Makoto Yamagata

Follow

Person

Tokyo, JP

People

Patents Applicationslast 30 patents

Information Patent Application
Metal Composite Laminate for Producing Flexible Wiring Board and Fl...
- Publication number 20090317591
- Publication date Dec 24, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- B32 - LAYERED PRODUCTS
Information Patent Application
Flexible Printed Wiring Board and Semiconductor Device
- Publication number 20080174016
- Publication date Jul 24, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor device excellent in folding endurance
- Publication number 20080006441
- Publication date Jan 10, 2008
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible copper clad laminate, flexible printed wiring board obtain...
- Publication number 20070098910
- Publication date May 3, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Two-layer flexible printed wiring board and method for manufacturin...
- Publication number 20070090086
- Publication date Apr 26, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Yamagata
- B32 - LAYERED PRODUCTS