Makoto Yanagida

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition and pre-preg, support-provided resin film,...
- Patent number 9,215,803
- Issue date Dec 15, 2015
- Hitachi Chemical Company, Ltd.
- Makoto Yanagida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg, metal-clad laminate, and printed circuit board
- Patent number 8,980,424
- Issue date Mar 17, 2015
- Hitachi Chemical Company, Ltd.
- Shuuji Gouzu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board
- Patent number 8,664,534
- Issue date Mar 4, 2014
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,871,694
- Issue date Jan 18, 2011
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,758,951
- Issue date Jul 20, 2010
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20130126218
- Publication date May 23, 2013
- Shuuji Gouzu
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM,...
- Publication number 20130108843
- Publication date May 2, 2013
- Makoto Yanagida
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20120285732
- Publication date Nov 15, 2012
- Kazumasa TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100270059
- Publication date Oct 28, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20100065313
- Publication date Mar 18, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
- Publication number 20080302558
- Publication date Dec 11, 2008
- Kazumasa TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same
- Publication number 20070287021
- Publication date Dec 13, 2007
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Makoto Yanagida

Person

Patents Grantslast 30 patents

Epoxy resin composition and pre-preg, support-provided resin film,...

Prepreg, metal-clad laminate, and printed circuit board

Printed wiring board

Prepreg, metal-clad laminate and printed circuit board using same

Prepreg, metal-clad laminate and printed circuit board using same

Patents Applicationslast 30 patents

PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM,...

MULTI-LAYER WIRING BOARD

PRINTED WIRING BOARD

MULTI-LAYER WIRING BOARD

PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same