Makoto Yoshino

Person

Beppu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,723,616
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated clip and lead and method of making a circuit
- Patent number 10,283,409
- Issue date May 7, 2019
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,233,074
- Issue date Mar 19, 2019
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method for packaging stress-sensitive micro-electro-m...
- Patent number 9,896,330
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated clip and lead and method of making a circuit
- Patent number 9,673,097
- Issue date Jun 6, 2017
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pop semiconductor device manufacturing method
- Patent number 8,048,358
- Issue date Nov 1, 2011
- Texas Instruments Incorporated
- Kiyoharu Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting substrate and semiconductor device usin...
- Patent number 6,965,162
- Issue date Nov 15, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package insulation film and manufacturing method thereof
- Patent number 6,894,374
- Issue date May 17, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package insulation film and manufacturing method thereof
- Patent number 6,875,637
- Issue date Apr 5, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20220352055
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20200354214
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20190169019
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20180127266
- Publication date May 10, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Clip and Lead and Method of Making a Circuit
- Publication number 20170236754
- Publication date Aug 17, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-M...
- Publication number 20170197823
- Publication date Jul 13, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CLIP AND LEAD AND METHOD OF MAKING A CIRCUIT
- Publication number 20160336256
- Publication date Nov 17, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP Semiconductor Device Manufacturing Method
- Publication number 20100015759
- Publication date Jan 21, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Kiyoharu Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP Semiconductor Device Manufacturing Method
- Publication number 20070243667
- Publication date Oct 18, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Kiyoharu Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package insulation film and manufacturing method thereof
- Publication number 20040070068
- Publication date Apr 15, 2004
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip mounting substrate and semiconductor device usin...
- Publication number 20030039102
- Publication date Feb 27, 2003
- Makoto Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package insulation film and manufacturing method thereof
- Publication number 20030017653
- Publication date Jan 23, 2003
- Makoto Yoshino
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Yoshino

Person

Patents Grantslast 30 patents

Heat-dissipating wirebonded members on package surfaces

Semiconductor device package with thermal pad

Structures for packaging stress-sensitive micro-electro-mechanical...

Bump bond structure for enhanced electromigration performance

Bump bond structure for enhanced electromigration performance

Structures for packaging stress-sensitive micro-electro-mechanical...

Integrated clip and lead and method of making a circuit

Structures for packaging stress-sensitive micro-electro-mechanical...

Structure and method for packaging stress-sensitive micro-electro-m...

Integrated clip and lead and method of making a circuit

Pop semiconductor device manufacturing method

Semiconductor chip mounting substrate and semiconductor device usin...

Semiconductor package insulation film and manufacturing method thereof

Semiconductor package insulation film and manufacturing method thereof

Patents Applicationslast 30 patents

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

Integrated Clip and Lead and Method of Making a Circuit

STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-M...

INTEGRATED CLIP AND LEAD AND METHOD OF MAKING A CIRCUIT

POP Semiconductor Device Manufacturing Method

POP Semiconductor Device Manufacturing Method

Semiconductor package insulation film and manufacturing method thereof

Semiconductor chip mounting substrate and semiconductor device usin...

Semiconductor package insulation film and manufacturing method thereof