Malavarayan SANKARASUBRAMANIAN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated inductor with composite magnetic resin layer
- Patent number 11,335,616
- Issue date May 17, 2022
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...
- Publication number 20220285288
- Publication date Sep 8, 2022
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20220102234
- Publication date Mar 31, 2022
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED INDUCTOR
- Publication number 20210098326
- Publication date Apr 1, 2021
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES
- Publication number 20200203470
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS
- Publication number 20200203067
- Publication date Jun 25, 2020
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...
- Publication number 20200013533
- Publication date Jan 9, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS
- Publication number 20200005983
- Publication date Jan 2, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT MATERIAL CONTAINING FLUOROPHORES FOR IN-SITU VISUALIZAT...
- Publication number 20190393112
- Publication date Dec 26, 2019
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS

Malavarayan SANKARASUBRAMANIAN

Person

Patents Grantslast 30 patents

Chip-scale package architectures containing a die back side metal a...

Microelectronic structures including bridges

Substrate integrated inductor with composite magnetic resin layer

Patents Applicationslast 30 patents

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SUBSTRATE INTEGRATED INDUCTOR

MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES

MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS

MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...

MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS

ENCAPSULANT MATERIAL CONTAINING FLUOROPHORES FOR IN-SITU VISUALIZAT...