Malcolm MacIntosh

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Escondido, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level flipchip package with IC circuit isolation
- Patent number 7,449,365
- Issue date Nov 11, 2008
- Broadcom Corporation
- Arya Reza Behzad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGER CAPACITOR STRUCTURES
- Publication number 20090230509
- Publication date Sep 17, 2009
- BROADCOM CORPORATION
- Malcolm MacIntosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level flipchip package with IC circuit isolation
- Publication number 20070139068
- Publication date Jun 21, 2007
- Broadcom Corporation, a California Corporation
- Arya Reza Behzad
- H01 - BASIC ELECTRIC ELEMENTS