Mami KUBOTA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,826,870
- Issue date Nov 28, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing semiconductor wafer
- Patent number 11,731,234
- Issue date Aug 22, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,717,931
- Issue date Aug 8, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CLEANING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING...
- Publication number 20240290665
- Publication date Aug 29, 2024
- SUMCO CORPORATION
- Ryosuke TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20210245321
- Publication date Aug 12, 2021
- SUMCO CORPORATION
- Mami KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORKPIECE
- Publication number 20210205949
- Publication date Jul 8, 2021
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20200346319
- Publication date Nov 5, 2020
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER
- Publication number 20200039021
- Publication date Feb 6, 2020
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING