Mami Shirota

Person

  • Wakayama-shi, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POLISHING LIQUID COMPOSITION

    • Publication number 20130109194
    • Publication date May 2, 2013
    • KAO CORPORATION
    • Mami SHIROTA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    POLISHING LIQUID COMPOSITION

    • Publication number 20100056026
    • Publication date Mar 4, 2010
    • KAO CORPORATION
    • Mami Shirota
    • B24 - GRINDING POLISHING
  • Information Patent Application

    POLISHING PROCESS OF A SEMICONDUCTOR SUBSTRATE

    • Publication number 20090181541
    • Publication date Jul 16, 2009
    • Yasuhiro YONEDA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Polishing composition for glass substrate

    • Publication number 20070145014
    • Publication date Jun 28, 2007
    • Kao Corporation.
    • Kazuhiko Nishimoto
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Polishing composition for a semiconductor substrate

    • Publication number 20070084828
    • Publication date Apr 19, 2007
    • Kao Corporation.
    • Yasuhiro Yoneda
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Polishing composition for a semiconductor substrate

    • Publication number 20060113283
    • Publication date Jun 1, 2006
    • Kao Corporation.
    • Yasuhiro Yoneda
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Stripping agent composition for a resist

    • Publication number 20050032659
    • Publication date Feb 10, 2005
    • Mami Shirota
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    Method of manufacturing semiconductor device with improved removal...

    • Publication number 20020012882
    • Publication date Jan 31, 2002
    • Mitsubishi Denki Kabushiki Kaisha and Kao Corporation
    • Seiji Muranaka
    • H01 - BASIC ELECTRIC ELEMENTS