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Mami Watanabe

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Patents Grantslast 30 patents

  • Information Patent Grant

    Tin or tin alloy plating solution
    • Patent number 11,268,203
    • Issue date Mar 8, 2022
    • Mitsubishi Materials Corporation
    • Mami Watanabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating liquid
    • Patent number 11,174,565
    • Issue date Nov 16, 2021
    • Mitsubishi Materials Corporation
    • Mami Watanabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Tin or tin alloy plating solution
    • Patent number 11,162,182
    • Issue date Nov 2, 2021
    • Mitsubishi Materials Corporation
    • Mami Watanabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating solution using ammonium salt
    • Patent number 10,450,665
    • Issue date Oct 22, 2019
    • Mitsubishi Materials Corporation
    • Mami Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating solution using sulfonium salt
    • Patent number 10,329,680
    • Issue date Jun 25, 2019
    • Mitsubishi Materials Corporation
    • Kiyotaka Nakaya
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating solution using phosphonium salt
    • Patent number 10,174,434
    • Issue date Jan 8, 2019
    • Mitsubishi Materials Corporation
    • Kiyotaka Nakaya
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    High-purity electrolytic copper and electrolytic refining method th...
    • Patent number 9,783,904
    • Issue date Oct 10, 2017
    • Mitsubishi Materials Corporation
    • Mami Watanabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents