Mamoru Nakamura

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Kyoto-shi, JP

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Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND...
- Publication number 20150017372
- Publication date Jan 15, 2015
- TOWA CORPORATION
- Hiroshi Uragami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin Sealing/Molding Apparatus
- Publication number 20090162467
- Publication date Jun 25, 2009
- Hiroshi Uragami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin Sealing and Molding Apparatus for Electronic Component
- Publication number 20090068302
- Publication date Mar 12, 2009
- Mamoru Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL