Mamoru Suwa

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin for semiconductor wire
- Patent number 6,700,198
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including stud bumps as external connection te...
- Patent number 6,541,848
- Issue date Apr 1, 2003
- Fujitsu Limited
- Toshimi Kawahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate for producing semiconductor device
- Patent number 6,348,416
- Issue date Feb 19, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,339,261
- Issue date Jan 15, 2002
- Shinko Electric Industries Co., Ltd.
- Masahiro Yonemochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure
- Patent number 6,329,711
- Issue date Dec 11, 2001
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, method of manufacturing semiconductor device...
- Publication number 20030132533
- Publication date Jul 17, 2003
- FUJITSU LIMITED
- Toshimi Kawahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TE...
- Publication number 20020105069
- Publication date Aug 8, 2002
- TOSHIMI KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin for semiconductor wire
- Publication number 20020019133
- Publication date Feb 14, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS