Mamoru YAMAGAMI

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,804,422
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with internal and exte...
- Patent number 11,616,009
- Issue date Mar 28, 2023
- ROHM CO., LTD.
- Yusuke Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,373,935
- Issue date Jun 28, 2022
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with internal and external electrode and metho...
- Patent number 11,004,782
- Issue date May 11, 2021
- Rohm Co., Ltd.
- Yusuke Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with external terminal
- Patent number 10,832,990
- Issue date Nov 10, 2020
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and method for manufacturing same
- Patent number 10,804,190
- Issue date Oct 13, 2020
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 10,070,530
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Motohiro Toyonaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with insulation layers
- Patent number 10,043,771
- Issue date Aug 7, 2018
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 9,947,553
- Issue date Apr 17, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,927,499
- Issue date Mar 27, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,905,499
- Issue date Feb 27, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,899,300
- Issue date Feb 20, 2018
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,613,883
- Issue date Apr 4, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with direction sensor elements
- Patent number 9,476,949
- Issue date Oct 25, 2016
- Rohm Co., Ltd.
- Taro Nishioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic unit provided with the same
- Patent number 9,293,399
- Issue date Mar 22, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,070,659
- Issue date Jun 30, 2015
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor element for solid electrolytic capacitor and process for...
- Patent number 5,734,546
- Issue date Mar 31, 1998
- Rohm Co. Ltd.
- Chojiro Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fused surface mounting type solid electrolytic capacitor
- Patent number 5,661,628
- Issue date Aug 26, 1997
- Rohm Co. Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state electrolytic capacitor having a concave
- Patent number 5,629,830
- Issue date May 13, 1997
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20240038635
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207444
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Yusuke HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20220293496
- Publication date Sep 15, 2022
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210225755
- Publication date Jul 22, 2021
- ROHM CO., LTD.
- Yusuke HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190287890
- Publication date Sep 19, 2019
- ROHM CO., LTD.
- Yusuke HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190080988
- Publication date Mar 14, 2019
- ROHM CO., LTD.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180130725
- Publication date May 10, 2018
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20180020549
- Publication date Jan 18, 2018
- Rohm Co., Ltd.
- Motohiro TOYONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170236772
- Publication date Aug 17, 2017
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170194234
- Publication date Jul 6, 2017
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170162485
- Publication date Jun 8, 2017
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170038438
- Publication date Feb 9, 2017
- ROHM CO., LTD.
- Mamoru YAMAGAMI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170040243
- Publication date Feb 9, 2017
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170034916
- Publication date Feb 2, 2017
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160240450
- Publication date Aug 18, 2016
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20160211198
- Publication date Jul 21, 2016
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20160190045
- Publication date Jun 30, 2016
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150294928
- Publication date Oct 15, 2015
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150255369
- Publication date Sep 10, 2015
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC UNIT PROVIDED WITH THE SAME
- Publication number 20150091143
- Publication date Apr 2, 2015
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150091164
- Publication date Apr 2, 2015
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH DIRECTION SENSOR ELEMENTS
- Publication number 20150035528
- Publication date Feb 5, 2015
- ROHM CO., LTD.
- Taro NISHIOKA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140312514
- Publication date Oct 23, 2014
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Mamoru YAMAGAMI

Person

Patents Grantslast 30 patents

Semiconductor package with plurality of leads and sealing resin

Semiconductor package with plurality of leads and sealing resin

Method of manufacturing semiconductor device with internal and exte...

Semiconductor package with plurality of leads and sealing resin

Semiconductor device with internal and external electrode and metho...

Semiconductor device with external terminal

Multi-chip module and method for manufacturing same

Semiconductor device

Semiconductor device

Electronic component and manufacturing method thereof

Semiconductor device with insulation layers

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device provided with direction sensor elements

Semiconductor device

Semiconductor device and electronic unit provided with the same

Semiconductor device

Capacitor element for solid electrolytic capacitor and process for...

Fused surface mounting type solid electrolytic capacitor

Solid state electrolytic capacitor having a concave

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MULTI-CHIP MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC UNIT PROVIDED WITH THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PROVIDED WITH DIRECTION SENSOR ELEMENTS

SEMICONDUCTOR DEVICE