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Man Ho Hui

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Mold for encapsulating a semiconductor chip
    • Patent number 6,860,731
    • Issue date Mar 1, 2005
    • ASM Technology Singapore Pte. Ltd.
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Mold and method for encapsulation of electronic device
    • Patent number 6,770,163
    • Issue date Aug 3, 2004
    • ASM Technology Singapore Pte. Ltd.
    • Teng Hock Kuah
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Molding apparatus
    • Patent number 6,709,252
    • Issue date Mar 23, 2004
    • ASM Technology Singapore PTE LTD
    • Jie Liu
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    Molding apparatus
    • Publication number 20030012836
    • Publication date Jan 16, 2003
    • Jie Liu
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Mold
    • Publication number 20030006529
    • Publication date Jan 9, 2003
    • ASM Technology Singapore Pte Ltd
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS