Man Kit Mui

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Universal bond head for wire bonders
- Patent number 8,434,669
- Issue date May 7, 2013
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding method incorporating remote pattern recognition system
- Patent number 8,091,762
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR