Man Kyo Jong

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Gyeongi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package having a substrate with bevelled edge
- Patent number 11,848,243
- Issue date Dec 19, 2023
- Infineon Technologies Austria AG
- Man Kyo Jong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Molded Heat Dissipation Plate
- Publication number 20240145325
- Publication date May 2, 2024
- Infineon Technologies Austria AG
- Joon Seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING A SUBSTRATE WITH BEVELLED EDGE
- Publication number 20220285239
- Publication date Sep 8, 2022
- Man Kyo Jong
- H01 - BASIC ELECTRIC ELEMENTS