Man Shing Cheng

Follow

Person

Hong Kong, CN

People

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stamped leadframe and method of manufacture thereof
- Publication number 20080122048
- Publication date May 29, 2008
- ASM Assembly Materials Ltd.
- Tat Chi Chan
- H01 - BASIC ELECTRIC ELEMENTS