Man Wai Chan

Follow

Person

Kwai Chung, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Device for holding multiple semiconductor devices during thermocomp...
- Patent number 9,484,241
- Issue date Nov 1, 2016
- ASM Technology Singapore Pte. Ltd.
- Man Chung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal die detachment apparatus
- Patent number 8,470,130
- Issue date Jun 25, 2013
- ASM Assembly Automation LTD
- Chi Ming Chong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control and monitoring system for thin die detachment and pick-up
- Patent number 8,092,645
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Siu Ping Yip
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fluid dispensing apparatus
- Patent number 6,367,669
- Issue date Apr 9, 2002
- ASM Assembly Automation LTD
- Yuk Cheung Au
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR HOLDING MULTIPLE SEMICONDUCTOR DEVICES DURING THERMOCOMP...
- Publication number 20150027616
- Publication date Jan 29, 2015
- Man Chung CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20110192547
- Publication date Aug 11, 2011
- Siu Ping YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL DIE DETACHMENT APPARATUS
- Publication number 20110088845
- Publication date Apr 21, 2011
- Chi Ming CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS