Manabu Horita

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device
- Patent number 10,192,811
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Tatsuya Fukase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with raised leads and plastic packaged semiconductor dev...
- Patent number 6,614,101
- Issue date Sep 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and apparatus
- Patent number 5,500,502
- Issue date Mar 19, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Manabu Horita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20170287819
- Publication date Oct 5, 2017
- Mitsubishi Electric Corporation
- Tatsuya FUKASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH RAISED LEADS AND PLASTIC PACKAGED SEMICONDUCTOR DEV...
- Publication number 20020105060
- Publication date Aug 8, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS