Manabu Iguchi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,337,093
- Issue date May 10, 2016
- Renesas Electronics Corporation
- Daisuke Oshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protective layer and method of manufactur...
- Patent number 8,946,800
- Issue date Feb 3, 2015
- Renesas Electronics Corporation
- Ippei Kume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,487,305
- Issue date Jul 16, 2013
- Renesas Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,329,584
- Issue date Dec 11, 2012
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,158,446
- Issue date Apr 17, 2012
- Renesas Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,955,980
- Issue date Jun 7, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manfacturing semiconductor device
- Patent number 7,601,640
- Issue date Oct 13, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,358,609
- Issue date Apr 15, 2008
- NEC Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with guard ring for preventing water from ente...
- Patent number 7,138,700
- Issue date Nov 21, 2006
- NEC Electronics Corporation
- Ryuji Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, and processing syste...
- Patent number 7,052,994
- Issue date May 30, 2006
- NEC Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multilayer interconnection structure an...
- Patent number 7,019,400
- Issue date Mar 28, 2006
- NEC Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having superior resistance to moisture
- Patent number 6,876,064
- Issue date Apr 5, 2005
- NEC Electronics Corporation
- Akira Matumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus of which reliability of interconnections is...
- Patent number 6,861,759
- Issue date Mar 1, 2005
- NEC Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating semiconductor device...
- Patent number 6,841,880
- Issue date Jan 11, 2005
- NEC Electronics Corporation
- Akira Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing interconnections t...
- Patent number 6,555,911
- Issue date Apr 29, 2003
- NEC Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multilayer interconnection structure
- Patent number 6,458,690
- Issue date Oct 1, 2002
- NEC Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed with metal wiring on a wafer by chemica...
- Patent number 6,379,782
- Issue date Apr 30, 2002
- NEC Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of copper interconnection and semiconductor wafer wi...
- Patent number 6,376,363
- Issue date Apr 23, 2002
- NEC Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,225,697
- Issue date May 1, 2001
- NEC Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming films of a semiconductor device, a method of...
- Patent number 6,149,730
- Issue date Nov 21, 2000
- NEC Corporation
- Yoshihisa Matsubara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130056850
- Publication date Mar 7, 2013
- Renesas Electronics Corporation
- Ippei KUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120161335
- Publication date Jun 28, 2012
- RENESAS ELECTRONICS CORPORATION
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120015517
- Publication date Jan 19, 2012
- RENESAS ELECTRONICS CORPORATION
- Daisuke OSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110230051
- Publication date Sep 22, 2011
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20100327447
- Publication date Dec 30, 2010
- NEC ELECTRONICS CORPORATION
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE ELEMENT AND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THE SAME
- Publication number 20100176483
- Publication date Jul 15, 2010
- NEC ELECTRONICS CORPORATION
- Manabu IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100001380
- Publication date Jan 7, 2010
- NEC Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090305496
- Publication date Dec 10, 2009
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANFACTURING SEMICONCUDTOR DEVICE
- Publication number 20080160750
- Publication date Jul 3, 2008
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060017167
- Publication date Jan 26, 2006
- NEC Electronics Corporation
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with guard ring for preventing water from ente...
- Publication number 20040195582
- Publication date Oct 7, 2004
- NEC ELECTRONICS CORPORATION
- Ryuji Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having multilayer interconnection structure an...
- Publication number 20040188845
- Publication date Sep 30, 2004
- NEC ELECTRONICS CORPORATION
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having multi-layer interconnection structure
- Publication number 20040155350
- Publication date Aug 12, 2004
- Akira Matumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having superior resistance to moisture
- Publication number 20040150073
- Publication date Aug 5, 2004
- NEC Electronics Corporation
- Akira Matumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating semiconductor device...
- Publication number 20040145028
- Publication date Jul 29, 2004
- NEC ELECTRONICS CORPORATION
- Akira Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus of which reliability of interconnections is...
- Publication number 20040000719
- Publication date Jan 1, 2004
- NEC Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device formed with metal wiring on a wafer by chemica...
- Publication number 20030039845
- Publication date Feb 27, 2003
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with multilayer wiring structure of laminated...
- Publication number 20020168812
- Publication date Nov 14, 2002
- Noriaki Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a multilayer interconnection structure
- Publication number 20020009878
- Publication date Jan 24, 2002
- NEC Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device, and processing syste...
- Publication number 20010036736
- Publication date Nov 1, 2001
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device formed with metal wiring on a wafer by chemica...
- Publication number 20010036737
- Publication date Nov 1, 2001
- Manabu Iguchi
- H01 - BASIC ELECTRIC ELEMENTS

Manabu Iguchi

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device with protective layer and method of manufactur...

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Method of manfacturing semiconductor device

Semiconductor device

Semiconductor device with guard ring for preventing water from ente...

Method for manufacturing semiconductor device, and processing syste...

Semiconductor device having multilayer interconnection structure an...

Semiconductor device having superior resistance to moisture

Semiconductor apparatus of which reliability of interconnections is...

Semiconductor device and method of fabricating semiconductor device...

Semiconductor device and method of manufacturing interconnections t...

Method for manufacturing a multilayer interconnection structure

Semiconductor device formed with metal wiring on a wafer by chemica...

Forming method of copper interconnection and semiconductor wafer wi...

Semiconductor device and method for manufacturing the same

Apparatus for forming films of a semiconductor device, a method of...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device and semiconductor device

FUSE ELEMENT AND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THE SAME

Semiconductor device and method of manufacturing the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANFACTURING SEMICONCUDTOR DEVICE

Semiconductor device

Semiconductor device with guard ring for preventing water from ente...

Semiconductor device having multilayer interconnection structure an...

Semiconductor device having multi-layer interconnection structure

Semiconductor device having superior resistance to moisture

Semiconductor device and method of fabricating semiconductor device...

Semiconductor apparatus of which reliability of interconnections is...

Semiconductor device formed with metal wiring on a wafer by chemica...

Semiconductor device with multilayer wiring structure of laminated...

Method for manufacturing a multilayer interconnection structure

Method for manufacturing semiconductor device, and processing syste...

Semiconductor device formed with metal wiring on a wafer by chemica...