Manato Furusawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Top ring for holding a substrate and substrate processing apparatus
- Patent number 11,701,750
- Issue date Jul 18, 2023
- Ebara Corporation
- Yu Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUCTION MEMBER, ELASTIC SEAL ASSEMBLY, TOP RING, AND SUBS...
- Publication number 20240416480
- Publication date Dec 19, 2024
- EBARA CORPORATION
- Kazuhiro TAJIMA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TRANSFER APPARATUS, AND APPARATUS FOR PROCESSING SUBSTRAT...
- Publication number 20240335920
- Publication date Oct 10, 2024
- EBARA CORPORATION
- Manato FURUSAWA
- B24 - GRINDING POLISHING
Information Patent Application
TRANSFER APPARATUS, CLEANING MODULE, AND SUBSTRATE PROCESSING APPAR...
- Publication number 20240001407
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Asagi MATSUGU
- B24 - GRINDING POLISHING
Information Patent Application
TOP RING FOR HOLDING A SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230249313
- Publication date Aug 10, 2023
- EBARA CORPORATION
- Yu Ishii
- B24 - GRINDING POLISHING
Information Patent Application
TOP RING FOR HOLDING A SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210170543
- Publication date Jun 10, 2021
- EBARA CORPORATION
- Yu Ishii
- B24 - GRINDING POLISHING