Mandar Painaik

Follow

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,966,321
- Issue date Mar 30, 2021
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,709,018
- Issue date Jul 7, 2020
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,356,903
- Issue date Jul 16, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Barriers for Selective Exposed Molding of Variable Height Components
- Publication number 20250105228
- Publication date Mar 27, 2025
- Apple Inc.
- Kyusang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES
- Publication number 20230078536
- Publication date Mar 16, 2023
- Apple Inc.
- Ali N. Ergun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20200375033
- Publication date Nov 26, 2020
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20190306979
- Publication date Oct 3, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR