Manfred Engelhardt

Person

Villach-Landskron, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for chemical vapor deposition process for semi...
- Patent number 11,149,351
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,672,716
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented edge protection shield
- Patent number 10,622,218
- Issue date Apr 14, 2020
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma systems and methods of processing using thereof
- Patent number 10,490,425
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing system
- Patent number 10,236,204
- Issue date Mar 19, 2019
- Infineon Technologies AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for processing a semiconductor workpiece
- Patent number 10,157,765
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods for forming a plurality of semicon...
- Patent number 10,074,566
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma system, chuck and method of making a semiconductor device
- Patent number 10,043,683
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tools and methods of forming devices using process tools
- Patent number 10,043,640
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma dicing of silicon carbide
- Patent number 10,032,670
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,020,264
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device and a semiconductor device
- Patent number 10,020,285
- Issue date Jul 10, 2018
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with buried isolation layers and methods of formation th...
- Patent number 9,875,926
- Issue date Jan 23, 2018
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented edge protection shield
- Patent number 9,793,129
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thermal annealing and a semiconductor device formed by t...
- Patent number 9,679,773
- Issue date Jun 13, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Chip packages and methods for manufacturing a chip package
- Patent number 9,666,452
- Issue date May 30, 2017
- Infineon Technologies AG
- Karl Adolf Dieter Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning in package using separation structure as stop
- Patent number 9,627,287
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric structures with negative taper and methods of formation...
- Patent number 9,613,848
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having insulating substrates and methods of f...
- Patent number 9,608,201
- Issue date Mar 28, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma system, chuck and method of making a semiconductor device
- Patent number 9,530,618
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,490,103
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device having a micro-mechanical structure
- Patent number 9,481,563
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Kerf preparation for backside metallization
- Patent number 9,455,192
- Issue date Sep 27, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation through a masking structure surrounding expitaxial regions
- Patent number 9,406,564
- Issue date Aug 2, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having insulating substrates and methods of f...
- Patent number 9,391,263
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable indicator structure in electronic chips of a common subst...
- Patent number 9,275,916
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,219,011
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for separating a plurality of dies and a processing device f...
- Patent number 9,165,895
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Helmut Brunner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication of micro lenses
- Patent number 9,030,744
- Issue date May 12, 2015
- Infineon Technologies AG
- Manfred Engelhardt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of protecting sidewall surfaces of a semiconductor device
- Patent number 9,012,325
- Issue date Apr 21, 2015
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR CHEMICAL VAPOR DEPOSITION PROCESS FOR SEMI...
- Publication number 20190078211
- Publication date Mar 14, 2019
- INFINEON TECHNOLOGIES AG
- Matthias Kuenle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20180315713
- Publication date Nov 1, 2018
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED EDGE PROTECTION SHIELD
- Publication number 20180005838
- Publication date Jan 4, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING OF SILICON CARBIDE
- Publication number 20170358494
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods for Forming a Plurality of Semicon...
- Publication number 20170338153
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Buried Isolation Layers and Methods of Formation Th...
- Publication number 20170154808
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Insulating Substrates and Methods of F...
- Publication number 20170148981
- Publication date May 25, 2017
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20170076970
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma System, Chuck and Method of Making a Semiconductor Device
- Publication number 20170076962
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
At least partially balancing out thickness variations of a substrate
- Publication number 20170062289
- Publication date Mar 2, 2017
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Systems and Methods of Processing Using Thereof
- Publication number 20170032986
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Edge Protection Shield
- Publication number 20160343574
- Publication date Nov 24, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20160322306
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESSING SYSTEM
- Publication number 20160293474
- Publication date Oct 6, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES HAVING INSULATING SUBSTRATES AND METHODS OF F...
- Publication number 20160284990
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Structures with Negative Taper and Methods of Formation...
- Publication number 20160240429
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing of Semiconductor Devices
- Publication number 20160240366
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Chips on a Substrate
- Publication number 20160111255
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Semiconductor Device and a Semiconductor Device
- Publication number 20160071819
- Publication date Mar 10, 2016
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kerf Preparation for Backside Metallization
- Publication number 20150279740
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Micro-Mechanical Structure
- Publication number 20150183631
- Publication date Jul 2, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process Tools and Methods of Forming Devices Using Process Tools
- Publication number 20150179413
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150147850
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Predetermined Kerf Regions and Methods of Fabrication Thereof
- Publication number 20150137144
- Publication date May 21, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinning in package using separation structure as stop
- Publication number 20150108666
- Publication date Apr 23, 2015
- INFINEON TECHNOLOGIES AG
- Manfred ENGELHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Chips on a Substrate
- Publication number 20150064879
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION
- Publication number 20150044856
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable indicator structure in electronic chips of a common subst...
- Publication number 20140327003
- Publication date Nov 6, 2014
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Semiconductor D...
- Publication number 20140291779
- Publication date Oct 2, 2014
- Manfred Engelhardt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices Having Insulating Substrates and Methods of F...
- Publication number 20140167192
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Manfred Engelhardt

Person

Patents Grantslast 30 patents

Apparatus and method for chemical vapor deposition process for semi...

Integrated circuit substrate and method for manufacturing the same

Segmented edge protection shield

Plasma systems and methods of processing using thereof

Semiconductor processing system

Methods for processing a semiconductor workpiece

Semiconductor device and methods for forming a plurality of semicon...

Plasma system, chuck and method of making a semiconductor device

Process tools and methods of forming devices using process tools

Plasma dicing of silicon carbide

Integrated circuit substrate and method for manufacturing the same

Method of producing a semiconductor device and a semiconductor device

Substrates with buried isolation layers and methods of formation th...

Segmented edge protection shield

Method for thermal annealing and a semiconductor device formed by t...

Chip packages and methods for manufacturing a chip package

Thinning in package using separation structure as stop

Dielectric structures with negative taper and methods of formation...

Semiconductor devices having insulating substrates and methods of f...

Plasma system, chuck and method of making a semiconductor device

Separation of chips on a substrate

Semiconductor device having a micro-mechanical structure

Kerf preparation for backside metallization

Singulation through a masking structure surrounding expitaxial regions

Semiconductor devices having insulating substrates and methods of f...

Removable indicator structure in electronic chips of a common subst...

Separation of chips on a substrate

Method for separating a plurality of dies and a processing device f...

Fabrication of micro lenses

Method of protecting sidewall surfaces of a semiconductor device

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR CHEMICAL VAPOR DEPOSITION PROCESS FOR SEMI...

Integrated Circuit Substrate and Method for Manufacturing the Same

SEGMENTED EDGE PROTECTION SHIELD

PLASMA DICING OF SILICON CARBIDE

Semiconductor Device and Methods for Forming a Plurality of Semicon...

Substrates with Buried Isolation Layers and Methods of Formation Th...

Semiconductor Devices Having Insulating Substrates and Methods of F...

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Plasma System, Chuck and Method of Making a Semiconductor Device

At least partially balancing out thickness variations of a substrate

Plasma Systems and Methods of Processing Using Thereof

Segmented Edge Protection Shield

Integrated Circuit Substrate and Method for Manufacturing the Same

SEMICONDUCTOR PROCESSING SYSTEM

SEMICONDUCTOR DEVICES HAVING INSULATING SUBSTRATES AND METHODS OF F...

Dielectric Structures with Negative Taper and Methods of Formation...

Processing of Semiconductor Devices

Separation of Chips on a Substrate

Method of Producing a Semiconductor Device and a Semiconductor Device

Kerf Preparation for Backside Metallization

Semiconductor Device Having a Micro-Mechanical Structure

Process Tools and Methods of Forming Devices Using Process Tools

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Predetermined Kerf Regions and Methods of Fabrication Thereof

Thinning in package using separation structure as stop

Separation of Chips on a Substrate

METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION

Removable indicator structure in electronic chips of a common subst...

Semiconductor Devices and Methods for Manufacturing Semiconductor D...

Semiconductor Devices Having Insulating Substrates and Methods of F...