Manfred Loddenkoetter

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Ibbenburen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Substrate for power semiconductor modules with through-plating of s...
- Patent number 6,715,203
- Issue date Apr 6, 2004
- EUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbH & Co. KG
- Thilo Stolze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Housing device and contact element to be used in the housing device
- Publication number 20030077940
- Publication date Apr 24, 2003
- Manfred Loddenkoetter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration for connecting power semiconductor chips in modules
- Publication number 20010026434
- Publication date Oct 4, 2001
- Manfred Loddenkoetter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for power semiconductor modules with through-plating of s...
- Publication number 20010022236
- Publication date Sep 20, 2001
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS