Manfred MENGEL

Person

Bad Abbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric devices and methods for forming thermoelectric devices
- Patent number 11,641,779
- Issue date May 2, 2023
- Infineon Technologies AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically insulating thermal interface on the discontinuity of a...
- Patent number 11,049,790
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer box, wafer stacking aid, wafer carrier, wafer transport syste...
- Patent number 10,546,767
- Issue date Jan 28, 2020
- Infineon Technologies AG
- Nina Wenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer box, method for arranging wafers in a wafer box, wafer protec...
- Patent number 10,535,542
- Issue date Jan 14, 2020
- Infineon Technologies AG
- Andreas Niederhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement including a ceramic layer
- Patent number 9,984,897
- Issue date May 29, 2018
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,790,086
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder alloys and arrangements
- Patent number 9,735,126
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,567,211
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically insulating thermal interface on the discontinuity of a...
- Patent number 9,437,513
- Issue date Sep 6, 2016
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with electronic chip between redistribution st...
- Patent number 9,385,111
- Issue date Jul 5, 2016
- Infineon Technologies Austria AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrophoretically depositing a film on an electronic a...
- Patent number 9,313,897
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low viscosity polymeric printing solutions and electronic component...
- Patent number 9,313,898
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Manfred Mengel
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing a chip package
- Patent number 9,245,868
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-package and a method for forming a chip-package
- Patent number 9,093,416
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,059,083
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two power semiconductor chips and manufacturing th...
- Patent number 9,048,338
- Issue date Jun 2, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,021,887
- Issue date May 5, 2015
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including a carrier and a semiconductor chip atta...
- Patent number 8,952,545
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 8,947,886
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,912,450
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for improving reliability of a semiconductor device
- Patent number 8,884,434
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,642,389
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Thomas Wowra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for manufacturing a device
- Patent number 8,633,600
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermoelectric Devices and Methods for Forming Thermoelectric Devices
- Publication number 20210210669
- Publication date Jul 8, 2021
- INFINEON TECHNOLOGIES AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface material having defined thermal, mechanical and e...
- Publication number 20210020541
- Publication date Jan 21, 2021
- Infineon Technologies Austria AG
- Christian KASZTELAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric Devices and Methods for Forming Thermoelectric Devices
- Publication number 20190131508
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOX, WAFER STACKING AID, WAFER CARRIER, WAFER TRANSPORT SYSTE...
- Publication number 20180033662
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Nina Wenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOX, METHOD FOR ARRANGING WAFERS IN A WAFER BOX, WAFER PROTEC...
- Publication number 20180033665
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Andreas Niederhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20170323865
- Publication date Nov 9, 2017
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Thermal interface material having defined thermal, mechanical and e...
- Publication number 20170117208
- Publication date Apr 27, 2017
- Infineon Technologies Austria AG
- Christian KASZTELAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20170004979
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20170003180
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Laminar Structure, a Semiconductor Device and Methods for Forming S...
- Publication number 20160372393
- Publication date Dec 22, 2016
- INFINEON TECHNOLOGIES AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically insulating thermal interface on the discontinuity of a...
- Publication number 20160372399
- Publication date Dec 22, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Electrophoretically Depositing a Film on an Electronic A...
- Publication number 20160240449
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150279782
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20150217994
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic component with electronic chip between redistribution st...
- Publication number 20150145111
- Publication date May 28, 2015
- Infineon Technologies Austria AG
- Manfred MENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20150111343
- Publication date Apr 23, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically insulating thermal interface on the discontinuity of a...
- Publication number 20150102479
- Publication date Apr 16, 2015
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140197527
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Electrophoretic Depositing (EPD) a Film on a System and S...
- Publication number 20140076613
- Publication date Mar 20, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...
- Publication number 20130328213
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Semiconductor Device and Semiconductor Device
- Publication number 20130277824
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL SEMICONDUCTOR SENSING DEVICE
- Publication number 20130152696
- Publication date Jun 20, 2013
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE
- Publication number 20130134589
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Power Semiconductor Chips and Manufacturing Th...
- Publication number 20130113114
- Publication date May 9, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection for Circuit Boards
- Publication number 20130063916
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Johannes Hankofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Manfred MENGEL

Person

Patents Grantslast 30 patents

Thermoelectric devices and methods for forming thermoelectric devices

Electrically insulating thermal interface on the discontinuity of a...

Chip arrangements

Wafer box, wafer stacking aid, wafer carrier, wafer transport syste...

Wafer box, method for arranging wafers in a wafer box, wafer protec...

Method for manufacturing a chip arrangement including a ceramic layer

Micromechanical semiconductor sensing device

Solder alloys and arrangements

Micromechanical semiconductor sensing device

Electronic component

Electrically insulating thermal interface on the discontinuity of a...

Chip arrangement, a method for manufacturing a chip arrangement, in...

Electronic component with electronic chip between redistribution st...

Chip arrangement, a method for manufacturing a chip arrangement, in...

Semiconductor device including a polymer disposed on a carrier

Method for electrophoretically depositing a film on an electronic a...

Low viscosity polymeric printing solutions and electronic component...

Method for manufacturing a chip package

Chip-package and a method for forming a chip-package

Semiconductor device

Device including two power semiconductor chips and manufacturing th...

Micromechanical semiconductor sensing device

Electronic device including a carrier and a semiconductor chip atta...

Chip package and method of forming the same

Electronic component

Method for attaching a metal surface to a carrier, a method for att...

Method and system for improving reliability of a semiconductor device

Semiconductor device with a layer including niobium, and/or tantalu...

Method of manufacturing a semiconductor device

Device and method for manufacturing a device

Patents Applicationslast 30 patents

Thermoelectric Devices and Methods for Forming Thermoelectric Devices

CHIP ARRANGEMENTS

Thermal interface material having defined thermal, mechanical and e...

Thermoelectric Devices and Methods for Forming Thermoelectric Devices

WAFER BOX, WAFER STACKING AID, WAFER CARRIER, WAFER TRANSPORT SYSTE...

WAFER BOX, METHOD FOR ARRANGING WAFERS IN A WAFER BOX, WAFER PROTEC...

CHIP ARRANGEMENTS

Thermal interface material having defined thermal, mechanical and e...

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Micromechanical Semiconductor Sensing Device

Laminar Structure, a Semiconductor Device and Methods for Forming S...

Electrically insulating thermal interface on the discontinuity of a...

Method for Electrophoretically Depositing a Film on an Electronic A...

SEMICONDUCTOR DEVICE

Micromechanical Semiconductor Sensing Device

Electronic component with electronic chip between redistribution st...

Electronic Component

Electrically insulating thermal interface on the discontinuity of a...

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...

Method of Electrophoretic Depositing (EPD) a Film on a System and S...

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...

Manufacturing Method for Semiconductor Device and Semiconductor Device

CHIP PACKAGE AND METHOD OF FORMING THE SAME

MICROMECHANICAL SEMICONDUCTOR SENSING DEVICE

CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE

Device Including Two Power Semiconductor Chips and Manufacturing Th...

Protection for Circuit Boards

Electronic Component