Manfred Schneegans

Person

Vaterstetten, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure of a power semiconductor device
- Patent number 11,239,188
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolyte, method of forming a copper layer and method of forming...
- Patent number 10,648,096
- Issue date May 12, 2020
- Infineon Technologies AG
- Werner Robl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,651,140
- Issue date May 12, 2020
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a die
- Patent number 10,340,227
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Markus Zundel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,090,265
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal pads
- Patent number 9,887,170
- Issue date Feb 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bondpad and bondpad
- Patent number 9,780,053
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Magdalena Hoier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal pads
- Patent number 9,666,546
- Issue date May 30, 2017
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system for processing semiconductor substrates, and methods...
- Patent number 9,640,419
- Issue date May 2, 2017
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device having a contact pad w...
- Patent number 9,620,466
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of semiconductor dies with contact metallization by ele...
- Patent number 9,449,876
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a protective structure on a chip ba...
- Patent number 9,209,080
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a copper layer on a semiconductor body using a...
- Patent number 9,190,322
- Issue date Nov 17, 2015
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench transistor cell array and man...
- Patent number 9,006,798
- Issue date Apr 14, 2015
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component
- Patent number 8,993,372
- Issue date Mar 31, 2015
- Infineon Technologies Austria AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having peripheral polymer structures
- Patent number 8,816,500
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for treating wafers on assembly carriers
- Patent number 8,753,176
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Grant
Multilayer metallization with stress-reducing interlayer
- Patent number 8,736,054
- Issue date May 27, 2014
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing an ultrathin semiconductor circuit
- Patent number 8,735,277
- Issue date May 27, 2014
- Infineon Technologies AG
- Dirk Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 8,709,876
- Issue date Apr 29, 2014
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and a carrier and fabrication...
- Patent number 8,637,379
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including bond wire directly bonded to pad
- Patent number 8,432,024
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a resist layer, uses of adhesive materials, and...
- Patent number 8,415,080
- Issue date Apr 9, 2013
- Infineon Technologies AG
- Werner Kroeninger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic device
- Patent number 8,264,072
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
- Publication number 20180366427
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20180350761
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Terminal Structure of a Power Semiconductor Device
- Publication number 20180145045
- Publication date May 24, 2018
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Metal Pads
- Publication number 20170317042
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20160379947
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A DIE
- Publication number 20160284648
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160260658
- Publication date Sep 8, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...
- Publication number 20160168739
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Werner ROBL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming a bondpad and bondpad
- Publication number 20160141259
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Magdalena HOIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160035654
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier System For Processing Semiconductor Substrates, and Methods...
- Publication number 20160035560
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20150235855
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Producing a Copper Layer on a Semiconductor Body Using a...
- Publication number 20150214095
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation of Semiconductor Dies with Contact Metallization by Ele...
- Publication number 20150206802
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Trench Transistor Cell Array and Man...
- Publication number 20140327053
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264865
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Producing the Same
- Publication number 20140167224
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PERIPHERAL POLYMER STRUCTURES
- Publication number 20140167266
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20140117509
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multilayer Metallization with Stress-Reducing Interlayer
- Publication number 20130026633
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130005144
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor component
- Publication number 20120225544
- Publication date Sep 6, 2012
- Manfred SCHNEEGANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A RESIST LAYER, USES OF ADHESIVE MATERIALS, AND...
- Publication number 20110269073
- Publication date Nov 3, 2011
- INFINEON TECHNOLOGIES AG
- Werner Kroninger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
- Publication number 20110260307
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for Treating Wafers on Assembly Carriers
- Publication number 20110146567
- Publication date Jun 23, 2011
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...
- Publication number 20110084369
- Publication date Apr 14, 2011
- INFINEON TECHNOLOGIES AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS

Manfred Schneegans

Person

Patents Grantslast 30 patents

Method of forming an aluminum oxide layer, metal surface with alumi...

Terminal structure of a power semiconductor device

Metallic interconnect, a method of manufacturing a metallic interco...

Electrolyte, method of forming a copper layer and method of forming...

Semiconductor device with metal structure electrically connected to...

Method of processing a porous conductive structure in connection to...

Method for processing a die

Semiconductor device with metal structure electrically connected to...

Method of manufacturing a layer structure having partially sealed p...

Source down semiconductor devices and methods of formation thereof

Multi-layer metal pads

Method of forming a bondpad and bondpad

Multi-layer metal pads

Carrier system for processing semiconductor substrates, and methods...

Method of manufacturing an electronic device having a contact pad w...

Singulation of semiconductor dies with contact metallization by ele...

Source down semiconductor devices and methods of formation thereof

Semiconductor device comprising a protective structure on a chip ba...

Method for producing a copper layer on a semiconductor body using a...

Semiconductor device including trench transistor cell array and man...

Method for producing a semiconductor component

Semiconductor device having peripheral polymer structures

Device for treating wafers on assembly carriers

Multilayer metallization with stress-reducing interlayer

Methods for producing an ultrathin semiconductor circuit

Electronic device

Device including a semiconductor chip and a carrier and fabrication...

Integrated circuit including bond wire directly bonded to pad

Method for applying a resist layer, uses of adhesive materials, and...

Electronic device

Patents Applicationslast 30 patents

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...

Semiconductor Device with Metal Structure Electrically Connected to...

Terminal Structure of a Power Semiconductor Device

Multi-Layer Metal Pads

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

Semiconductor Device with Metal Structure Electrically Connected to...

METHOD FOR PROCESSING A DIE

Source Down Semiconductor Devices and Methods of Formation Thereof

ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...

Method of forming a bondpad and bondpad

Source Down Semiconductor Devices and Methods of Formation Thereof

Carrier System For Processing Semiconductor Substrates, and Methods...

Metal Deposition with Reduced Stress

Method for Producing a Copper Layer on a Semiconductor Body Using a...

Singulation of Semiconductor Dies with Contact Metallization by Ele...

Semiconductor Device Including Trench Transistor Cell Array and Man...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Producing the Same

SEMICONDUCTOR DEVICE HAVING PERIPHERAL POLYMER STRUCTURES

Metal Deposition with Reduced Stress

Multilayer Metallization with Stress-Reducing Interlayer

ELECTRONIC DEVICE

Method for producing a semiconductor component

METHOD FOR APPLYING A RESIST LAYER, USES OF ADHESIVE MATERIALS, AND...

INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD

Device for Treating Wafers on Assembly Carriers

SEMICONDUCTOR DEVICE

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...