Manfred Thurner

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Patents Grantslast 30 patents

Information Patent Grant
Process for producing a semiconductor wafer
- Patent number 6,997,776
- Issue date Feb 14, 2006
- Siltronic AG
- Gunther Kann
- B24 - GRINDING POLISHING
Information Patent Grant
Process and device for polishing semiconductor wafers
- Patent number 6,095,898
- Issue date Aug 1, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Heinrich Hennhofer
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for polishing semiconductor wafers
- Patent number 5,980,361
- Issue date Nov 9, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Paul Muller
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Process for producing a semiconductor wafer
- Publication number 20050170749
- Publication date Aug 4, 2005
- Gunther Kann
- B24 - GRINDING POLISHING