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Manho Lee

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  • Hwaseong-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Integrated circuit chip having BS-PDN structure
    • Patent number 11,984,421
    • Issue date May 14, 2024
    • Samsung Electronics Co., Ltd.
    • Eunseok Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,862,618
    • Issue date Jan 2, 2024
    • Samsung Electronics Co., Ltd.
    • Manho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,631,660
    • Issue date Apr 18, 2023
    • Samsung Electronics Co., Ltd.
    • Manho Lee
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240088118
    • Publication date Mar 14, 2024
    • Samsung Electronics Co., Ltd.
    • Manho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...
    • Publication number 20240055395
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Manho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230260983
    • Publication date Aug 17, 2023
    • Samsung Electronics Co., Ltd.
    • Manho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230223390
    • Publication date Jul 13, 2023
    • Manho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
    • Publication number 20220352128
    • Publication date Nov 3, 2022
    • Samsung Electronics Co., Ltd.
    • Manho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220165721
    • Publication date May 26, 2022
    • Samsung Electronics Co., Ltd.
    • Manho LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
    • Publication number 20220139863
    • Publication date May 5, 2022
    • Samsung Electronics Co., Ltd.
    • Eunseok Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220059519
    • Publication date Feb 24, 2022
    • Samsung Electronics Co., Ltd.
    • Manho Lee
    • H01 - BASIC ELECTRIC ELEMENTS