Manho Lee

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a plurality of semiconductor chips
- Patent number 12,057,441
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having BS-PDN structure
- Patent number 11,984,421
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,618
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,631,660
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...
- Publication number 20240284683
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088118
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...
- Publication number 20240055395
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260983
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223390
- Publication date Jul 13, 2023
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20220352128
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165721
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
- Publication number 20220139863
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220059519
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package including a plurality of semiconductor chips

Integrated circuit chip having BS-PDN structure

Semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE

SEMICONDUCTOR PACKAGE