Manickam Thavarajah

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and process utilizing pre-formed mold cap and...
- Patent number 7,436,060
- Issue date Oct 14, 2008
- LSI Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically connected...
- Patent number 6,933,602
- Issue date Aug 23, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct positive image photo-resist transfer of substrate design
- Patent number 6,872,321
- Issue date Mar 29, 2005
- LSI Logic Corporation
- Manickam Thavarajah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference package protection
- Patent number 6,867,480
- Issue date Mar 15, 2005
- LSI Logic Corporation
- Severino A. Legaspi, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic organic substrate
- Patent number 6,801,437
- Issue date Oct 5, 2004
- LSI Logic Corporation
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask on bonding ring
- Patent number 6,777,803
- Issue date Aug 17, 2004
- LSI Logic Corporation
- Maurice Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate
- Patent number 6,603,201
- Issue date Aug 5, 2003
- LSI Logic Corporation
- Manickam Thavarajah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package via
- Patent number 6,555,914
- Issue date Apr 29, 2003
- LSI Logic Corporation
- Aritharan Thurairajaratnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for testing a flip chip integrated circuit pac...
- Patent number 6,117,695
- Issue date Sep 12, 2000
- LSI Logic Corporation
- Adrian S. Murphy
- G01 - MEASURING TESTING
Information Patent Grant
Vacuum assisted underfill process and apparatus for semiconductor p...
- Patent number 5,998,242
- Issue date Dec 7, 1999
- LSI Logic Corporation
- Galen C. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer or die strength test fixture using high pressure fluid
- Patent number 5,992,242
- Issue date Nov 30, 1999
- LSI Logic Corporation
- Adrian Murphy
- G01 - MEASURING TESTING
Information Patent Grant
Stiffener ring and heat spreader for use with flip chip packaging a...
- Patent number 5,949,137
- Issue date Sep 7, 1999
- LSI Logic Corporation
- Ashok Domadia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laminate package with integral mold gate
- Patent number 5,886,398
- Issue date Mar 23, 1999
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Strip for integrated circuit packages having a maximized usable area
- Publication number 20070163109
- Publication date Jul 19, 2007
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and process utilizing pre-formed mold cap and...
- Publication number 20050275086
- Publication date Dec 15, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic interference package protection
- Publication number 20040251522
- Publication date Dec 16, 2004
- Severino A. Legaspi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic organic substrate
- Publication number 20040142556
- Publication date Jul 22, 2004
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct positive image photo-resist transfer of substrate design
- Publication number 20040056939
- Publication date Mar 25, 2004
- Manickam Thavarajah
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Solder mask on bonding ring
- Publication number 20040041252
- Publication date Mar 4, 2004
- Maurice Othieno
- H01 - BASIC ELECTRIC ELEMENTS

Manickam Thavarajah

Person

Patents Grantslast 30 patents

Semiconductor package and process utilizing pre-formed mold cap and...

Semiconductor package having a thermally and electrically connected...

Direct positive image photo-resist transfer of substrate design

Electromagnetic interference package protection

Electronic organic substrate

Solder mask on bonding ring

Electronic substrate

Integrated circuit package via

Apparatus and method for testing a flip chip integrated circuit pac...

Vacuum assisted underfill process and apparatus for semiconductor p...

Silicon wafer or die strength test fixture using high pressure fluid

Stiffener ring and heat spreader for use with flip chip packaging a...

Molded laminate package with integral mold gate

Patents Applicationslast 30 patents

Strip for integrated circuit packages having a maximized usable area

Semiconductor package and process utilizing pre-formed mold cap and...

Electromagnetic interference package protection

Electronic organic substrate

Direct positive image photo-resist transfer of substrate design

Solder mask on bonding ring