Manish Dubey

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 12,176,292
- Issue date Dec 24, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,817,390
- Issue date Nov 14, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channeled lids for integrated circuit packages
- Patent number 11,670,569
- Issue date Jun 6, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,640,942
- Issue date May 2, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,302,643
- Issue date Apr 12, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foam composite
- Patent number 10,651,108
- Issue date May 12, 2020
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic package that includes multi-layer stiffener
- Patent number 10,535,615
- Issue date Jan 14, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient encapsulant protection of devices in stretchable electronics
- Patent number 10,206,277
- Issue date Feb 12, 2019
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Grant
Electronic package and method of connecting a first die to a second...
- Patent number 9,887,104
- Issue date Feb 6, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with corner supports
- Patent number 9,721,906
- Issue date Aug 1, 2017
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die having chamfered corners
- Patent number 9,508,660
- Issue date Nov 29, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20240030142
- Publication date Jan 25, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20230134770
- Publication date May 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...
- Publication number 20220199503
- Publication date Jun 23, 2022
- Intel Corporation
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20220181262
- Publication date Jun 9, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391273
- Publication date Dec 16, 2021
- Interl Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20210305162
- Publication date Sep 30, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...
- Publication number 20210020537
- Publication date Jan 21, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL
- Publication number 20200411407
- Publication date Dec 31, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNELED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200395269
- Publication date Dec 17, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200227332
- Publication date Jul 16, 2020
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
- Publication number 20200006273
- Publication date Jan 2, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVELENGTH MODULATABLE INTERFEROMETER
- Publication number 20180283845
- Publication date Oct 4, 2018
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER
- Publication number 20180033741
- Publication date Feb 1, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS
- Publication number 20170181275
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Application
ELECTRONIC PACKAGE WITH CORNER SUPPORTS
- Publication number 20170062356
- Publication date Mar 2, 2017
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
- Publication number 20170018525
- Publication date Jan 19, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20160343591
- Publication date Nov 24, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
- Publication number 20160233175
- Publication date Aug 11, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...
- Publication number 20160005672
- Publication date Jan 7, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20150179479
- Publication date Jun 25, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20140377916
- Publication date Dec 25, 2014
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20140177149
- Publication date Jun 26, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS

Manish Dubey

Person

Patents Grantslast 30 patents

Open cavity bridge co-planar placement architectures and processes

Microelectronic component having molded regions with through-mold vias

Microelectronic structures including bridges

Microelectronic component having molded regions with through-mold vias

Integrated heat spreader (IHS) with heating element

Multichip semiconductor package including a bridge die disposed in...

Channeled lids for integrated circuit packages

Microelectronic component having molded regions with through-mold vias

Thermal management solutions for integrated circuit packages

Microelectronic component having molded regions with through-mold vias

Foam composite

Electronic package that includes multi-layer stiffener

Gradient encapsulant protection of devices in stretchable electronics

Electronic package and method of connecting a first die to a second...

Electronic package with corner supports

Microelectronic die having chamfered corners

Method for reducing underfill filler settling in integrated circuit...

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Patents Applicationslast 30 patents

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL

CHANNELED LIDS FOR INTEGRATED CIRCUIT PACKAGES

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE

WAVELENGTH MODULATABLE INTERFEROMETER

ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER

GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS

ELECTRONIC PACKAGE WITH CORNER SUPPORTS

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC DIE HAVING CHAMFERED CORNERS

ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES