Manish Ranjan

Person

Sherwood, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrochemical deposition system including optical probes
- Patent number 12,180,607
- Issue date Dec 31, 2024
- Lam Research Corporation
- Andrew James Pfau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for in-situ measurement of sheet resistance on...
- Patent number 12,105,039
- Issue date Oct 1, 2024
- Lam Research Corporation
- Manish Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for controlling substrate approach toward a tar...
- Patent number 11,621,187
- Issue date Apr 4, 2023
- Lam Research Corporation
- Douglas Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 10,968,531
- Issue date Apr 6, 2021
- Novellus Systems, Inc.
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for controlling substrate approach toward a tar...
- Patent number 10,593,586
- Issue date Mar 17, 2020
- Lam Research Corporation
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for estimating on-wafer oxide layer reducti...
- Patent number 10,497,592
- Issue date Dec 3, 2019
- Lam Research Corporation
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for estimating on-wafer oxide layer reducti...
- Patent number 9,735,035
- Issue date Aug 15, 2017
- Lam Research Corporation
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 9,587,322
- Issue date Mar 7, 2017
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 9,028,666
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR IN-SITU MEASUREMENT OF SHEET RESISTANCE ON...
- Publication number 20250003908
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Manish Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20230245917
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IN-SITU MONITORING OF SUBSTRATE SURFACES
- Publication number 20220349850
- Publication date Nov 3, 2022
- LAM RESEARCH CORPORATION
- Manish Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES
- Publication number 20220228287
- Publication date Jul 21, 2022
- LAM RESEARCH CORPORATION
- Andrew James PFAU
- G01 - MEASURING TESTING
Information Patent Application
IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS
- Publication number 20210366768
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Zhian HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20200219754
- Publication date Jul 9, 2020
- LAM RESEARCH CORPORATION
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20180266007
- Publication date Sep 20, 2018
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...
- Publication number 20170309505
- Publication date Oct 26, 2017
- LAM RESEARCH CORPORATION
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...
- Publication number 20170221740
- Publication date Aug 3, 2017
- LAM RESEARCH CORPORATION
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...
- Publication number 20170137958
- Publication date May 18, 2017
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...
- Publication number 20150218727
- Publication date Aug 6, 2015
- Novellus Systems, Inc.
- Manish Ranjan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...
- Publication number 20120292192
- Publication date Nov 22, 2012
- Manish RANJAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Manish Ranjan

Person

Patents Grantslast 30 patents

Electrochemical deposition system including optical probes

Systems and methods for in-situ measurement of sheet resistance on...

Systems and methods for controlling substrate approach toward a tar...

Monitoring surface oxide on seed layers during electroplating

Wetting wave front control for reduced air entrapment during wafer...

Systems and methods for controlling substrate approach toward a tar...

Methods and apparatuses for estimating on-wafer oxide layer reducti...

Monitoring surface oxide on seed layers during electroplating

Methods and apparatuses for estimating on-wafer oxide layer reducti...

Wetting wave front control for reduced air entrapment during wafer...

Wetting wave front control for reduced air entrapment during wafer...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR IN-SITU MEASUREMENT OF SHEET RESISTANCE ON...

Systems and Methods for Controlling Substrate Approach Toward a Tar...

IN-SITU MONITORING OF SUBSTRATE SURFACES

ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES

IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS

Systems and Methods for Controlling Substrate Approach Toward a Tar...

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

Systems and Methods for Controlling Substrate Approach Toward a Tar...

METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...

METHODS AND APPARATUSES FOR ESTIMATING ON-WAFER OXIDE LAYER REDUCTI...

WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...

WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...

WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER...