Manjula N. Variyam

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Patent number 7,679,190
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Patent number 7,294,451
- Issue date Nov 13, 2007
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding simulation
- Patent number 7,085,699
- Issue date Aug 1, 2006
- Texas Instruments Incorporated
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for chip-to-package interconnection
- Patent number 6,953,707
- Issue date Oct 11, 2005
- Texas Instruments Incorporated
- Manjula N. Variyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer-embedded solder bumps for reliable plastic package attachment
- Patent number 6,696,644
- Issue date Feb 24, 2004
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate El...
- Publication number 20080023834
- Publication date Jan 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding simulation
- Publication number 20050133566
- Publication date Jun 23, 2005
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Publication number 20050106505
- Publication date May 19, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for chip-to-package interconnection
- Publication number 20040241909
- Publication date Dec 2, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Manjula N. Variyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer-embedded solder bumps for reliable plastic package attachment
- Publication number 20040149479
- Publication date Aug 5, 2004
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POLYMER-EMBEDDED SOLDER BUMPS FOR RELIABLE PLASTIC PACKAGE ATTACHMENT
- Publication number 20040027788
- Publication date Feb 12, 2004
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Manjula N. Variyam

Person

Patents Grantslast 30 patents

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

Wire bonding simulation

Method and system for chip-to-package interconnection

Polymer-embedded solder bumps for reliable plastic package attachment

Patents Applicationslast 30 patents

Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate El...

Wire bonding simulation

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

Method and system for chip-to-package interconnection

Polymer-embedded solder bumps for reliable plastic package attachment

POLYMER-EMBEDDED SOLDER BUMPS FOR RELIABLE PLASTIC PACKAGE ATTACHMENT