ManKit Lam

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Colorado Springs, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having exposed redistribution layer features...
- Patent number 11,600,523
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPEC...
- Publication number 20250218920
- Publication date Jul 3, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...
- Publication number 20250054914
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHOD...
- Publication number 20240421230
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EXPOSED REDISTRIBUTION LAYER FEATURES...
- Publication number 20180294186
- Publication date Oct 11, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS