Mankyo JONG

Person

Bucheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked multichip modules
- Patent number 10,658,342
- Issue date May 19, 2020
- Semiconductor Components Industries, LLC
- Mankyo Jong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and manufacturing method
- Patent number 10,586,754
- Issue date Mar 10, 2020
- Semiconductor Components Industries, LLC (BHB)
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked multichip modules
- Patent number 10,483,237
- Issue date Nov 19, 2019
- Semiconductor Components Industries, LLC
- Mankyo Jong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,403,601
- Issue date Sep 3, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices and mo...
- Patent number 10,090,279
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210265318
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED MULTICHIP MODULES
- Publication number 20190393196
- Publication date Dec 26, 2019
- Semiconductor Components Industries, LLC
- Mankyo JONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190348399
- Publication date Nov 14, 2019
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...
- Publication number 20180254262
- Publication date Sep 6, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED MULTICHIP MODULES
- Publication number 20180138152
- Publication date May 17, 2018
- FAIRCHILD KOREA SEMICONDUCTOR LTD.
- Mankyo JONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD
- Publication number 20180122725
- Publication date May 3, 2018
- FAIRCHILD KOREA SEMICONDUCTOR LTD.
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170365583
- Publication date Dec 21, 2017
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Mankyo JONG

Person

Patents Grantslast 30 patents

Semiconductor package and related methods

Vertically stacked multichip modules

Semiconductor die package and manufacturing method

Vertically stacked multichip modules

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices and mo...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS

VERTICALLY STACKED MULTICHIP MODULES

SEMICONDUCTOR PACKAGE AND RELATED METHODS

STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...

VERTICALLY STACKED MULTICHIP MODULES

SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND RELATED METHODS