Manohar S. Konchady

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming a package substrate
- Patent number 11,443,970
- Issue date Sep 13, 2022
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist layers for coreless packages and methods of fabrication
- Patent number 10,629,469
- Issue date Apr 21, 2020
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side solder resist layers for coreless packages and packages w...
- Patent number 9,704,735
- Issue date Jul 11, 2017
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 9,312,237
- Issue date Apr 12, 2016
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 8,952,532
- Issue date Feb 10, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device embedded within a microelectronic die
- Patent number 8,907,461
- Issue date Dec 9, 2014
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND METHODS OF FABRICATION
- Publication number 20200194300
- Publication date Jun 18, 2020
- Intel Corporation
- Manohar S. KONCHADY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...
- Publication number 20170250150
- Publication date Aug 31, 2017
- Intel Corporation
- Manohar S. KONCHADY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...
- Publication number 20160056102
- Publication date Feb 25, 2016
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20150108204
- Publication date Apr 23, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE EMBEDDED WITHIN A MICROELECTRONIC DIE
- Publication number 20140353817
- Publication date Dec 4, 2014
- Manohar S Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20140332956
- Publication date Nov 13, 2014
- Tieyu ZHENG
- H01 - BASIC ELECTRIC ELEMENTS