Manoj Narayanan

Person

Woodridge, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabrication of crack-free ceramic dielectric films
- Patent number 9,834,843
- Issue date Dec 5, 2017
- UChicago Argonne, LLC
- Beihai Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabrication of ceramic dielectric films on copper foils
- Patent number 9,679,705
- Issue date Jun 13, 2017
- UChicago Argonne, LLC
- Beihai Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing thin film electrodes
- Patent number 9,359,223
- Issue date Jun 7, 2016
- UChicago Argonne, LLC
- Manoj Narayanan
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for fabrication of crack-free ceramic dielectric films
- Patent number 9,355,761
- Issue date May 31, 2016
- UChicago Argonne, LLC
- Beihai Ma
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for fabrication of ceramic dielectric films on copper foils
- Patent number 8,974,856
- Issue date Mar 10, 2015
- UChicago Argonne, LLC
- Beihai Ma
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for fabrication of crack-free ceramic dielectric films
- Patent number 8,647,737
- Issue date Feb 11, 2014
- UChicago Argonne, LLC
- Beihai Ma
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS
- Publication number 20160376708
- Publication date Dec 29, 2016
- UChicago Argonne, LLC
- Beihai Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY MATERIALS FOR USE IN ELECTROIDES
- Publication number 20160278215
- Publication date Sep 22, 2016
- UChicago Argonne, LLC
- Uthamalingam Balachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS
- Publication number 20150170845
- Publication date Jun 18, 2015
- UChicago Argonne, LLC
- Beihai MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS
- Publication number 20140120736
- Publication date May 1, 2014
- Beihai Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS
- Publication number 20130084444
- Publication date Apr 4, 2013
- UChicago Argonne, LLC
- Beihai Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING THIN FILM ELECTRODES
- Publication number 20130071670
- Publication date Mar 21, 2013
- UChicago Argonne, LLC
- Manoj Narayanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS
- Publication number 20100302706
- Publication date Dec 2, 2010
- UChicago Argonne, LLC
- Beihai MA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRESS-BIASED CYMBALS INCORPORATING A SHAPE MEMORY ALLOY
- Publication number 20090303839
- Publication date Dec 10, 2009
- Manoj Narayanan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Manoj Narayanan

Person

Patents Grantslast 30 patents

Method for fabrication of crack-free ceramic dielectric films

Method for fabrication of ceramic dielectric films on copper foils

Method for producing thin film electrodes

Method for fabrication of crack-free ceramic dielectric films

Method for fabrication of ceramic dielectric films on copper foils

Method for fabrication of crack-free ceramic dielectric films

Patents Applicationslast 30 patents

METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS

LOW RESISTIVITY MATERIALS FOR USE IN ELECTROIDES

METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS

METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS

METHOD FOR FABRICATION OF CRACK-FREE CERAMIC DIELECTRIC FILMS

METHOD FOR PRODUCING THIN FILM ELECTRODES

METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS

STRESS-BIASED CYMBALS INCORPORATING A SHAPE MEMORY ALLOY