Manu J. Prakuzhy

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,901,271
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,545,420
- Issue date Jan 3, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multichip module with conductive connectors
- Patent number 11,538,742
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multichip module with conductive connectors
- Patent number 10,622,290
- Issue date Apr 14, 2020
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 10,607,927
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- Manu J. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned die pad for packaged vertical semiconductor devices
- Patent number 10,497,643
- Issue date Dec 3, 2019
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,165,873
- Issue date Oct 20, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,142,496
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT
- Publication number 20230145761
- Publication date May 11, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING AN ENHANCED THERMAL DISSIPATION PACKAGE
- Publication number 20220344232
- Publication date Oct 27, 2022
- TEXAS INSTRUMENTS INCORPORATED
- MANU JOSEPH PRAKUZHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT
- Publication number 20200258825
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS
- Publication number 20200243428
- Publication date Jul 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS
- Publication number 20200020620
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED DIE PAD FOR PACKAGED VERTICAL SEMICONDUCTOR DEVICES
- Publication number 20190348346
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- SIVA PRAKASH GURRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20180076116
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Manu J. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS

Manu J. Prakuzhy

Person

Patents Grantslast 30 patents

High current packages with reduced solder layer count

High current packages with reduced solder layer count

Packaged multichip module with conductive connectors

Packaged multichip module with conductive connectors

Spot-solderable leads for semiconductor device packages

Patterned die pad for packaged vertical semiconductor devices

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Patents Applicationslast 30 patents

HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT

INTEGRATED CIRCUIT HAVING AN ENHANCED THERMAL DISSIPATION PACKAGE

HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT

PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS

PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS

PATTERNED DIE PAD FOR PACKAGED VERTICAL SEMICONDUCTOR DEVICES

Spot-Solderable Leads for Semiconductor Device Packages

Semiconductor Package Having Etched Foil Capacitor Integrated Into...