Manuel ALDRETE

Person

Encinitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mixed pad size and pad design
- Patent number 11,804,428
- Issue date Oct 31, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal shielding for solder ball array
- Patent number 10,879,191
- Issue date Dec 29, 2020
- QUALCOMM Incorporated
- Daniel Daeik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Segmented thermal and RF ground
- Patent number 10,511,268
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity mold
- Patent number 10,490,472
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with RF structure
- Patent number 10,431,511
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide along shielded side wall
- Patent number 10,418,333
- Issue date Sep 17, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded stacked substrate apparatus and method of fabricating
- Patent number 10,325,859
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and method of making same
- Patent number 10,319,694
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Daniel Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive post protection for integrated circuit packages
- Patent number 9,768,108
- Issue date Sep 19, 2017
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising improved via pad placement in bump area
- Patent number 9,466,578
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through mold via relief gutter on molded laser package (MLP) packages
- Patent number 9,313,881
- Issue date Apr 12, 2016
- QUALCOMM Incorporated
- Christopher J. Healy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface finish on trace for a thermal compression flip chip (TCFC)
- Patent number 9,269,681
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer on bump and non-wettable coating on trace
- Patent number 8,802,556
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...
- Publication number 20240243056
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...
- Publication number 20230369230
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED PAD SIZE AND PAD DESIGN
- Publication number 20220157705
- Publication date May 19, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING DUMMY INTERCONNECTS
- Publication number 20210280507
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL SHIELDING FOR SOLDER BALL ARRAY
- Publication number 20200219822
- Publication date Jul 9, 2020
- QUALCOMM Incorporated
- Daniel Daeik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED CORNER PACKAGE FOR EMI SHIELD
- Publication number 20190341352
- Publication date Nov 7, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY MOLD
- Publication number 20190067141
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED THERMAL AND RF GROUND
- Publication number 20190006999
- Publication date Jan 3, 2019
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER WITH RF STRUCTURE
- Publication number 20180316319
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIRE-BOND CAGE IN CONFORMAL SHIELDING
- Publication number 20180228016
- Publication date Aug 9, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME
- Publication number 20180047687
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DRILL EMBEDDED DIE SUBSTRATE
- Publication number 20170271266
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PACKAGE CONNECTOR
- Publication number 20170084523
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20160247754
- Publication date Aug 25, 2016
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...
- Publication number 20160148864
- Publication date May 26, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20150206812
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA
- Publication number 20150179590
- Publication date Jun 25, 2015
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140322868
- Publication date Oct 30, 2014
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES
- Publication number 20140196940
- Publication date Jul 17, 2014
- QUALCOMM Incorporated
- Christopher J. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORING A TRACE ON A SUBSTRATE TO REDUCE PEELING OF THE TRACE
- Publication number 20140175658
- Publication date Jun 26, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING THERMAL COMPRESSION FLIP CHIP (TCFC) AND CHIP WITH R...
- Publication number 20140159238
- Publication date Jun 12, 2014
- QUALCOMM Incorporated
- Manuel Aldrete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)
- Publication number 20140138831
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140131857
- Publication date May 15, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS

Manuel ALDRETE

Person

Patents Grantslast 30 patents

Mixed pad size and pad design

Conformal shielding for solder ball array

Segmented thermal and RF ground

Air cavity mold

Power amplifier with RF structure

Waveguide along shielded side wall

Backside drill embedded die substrate

Shielded stacked substrate apparatus and method of fabricating

Semiconductor assembly and method of making same

Conductive post protection for integrated circuit packages

Substrate comprising improved via pad placement in bump area

Through mold via relief gutter on molded laser package (MLP) packages

Surface finish on trace for a thermal compression flip chip (TCFC)

Barrier layer on bump and non-wettable coating on trace

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...

MIXED PAD SIZE AND PAD DESIGN

PACKAGE COMPRISING DUMMY INTERCONNECTS

CONFORMAL SHIELDING FOR SOLDER BALL ARRAY

TAPERED CORNER PACKAGE FOR EMI SHIELD

AIR CAVITY MOLD

SEGMENTED THERMAL AND RF GROUND

POWER AMPLIFIER WITH RF STRUCTURE

WIRE-BOND CAGE IN CONFORMAL SHIELDING

SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME

BACKSIDE DRILL EMBEDDED DIE SUBSTRATE

ON-PACKAGE CONNECTOR

CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES

INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...

SUBSTRATE AND METHOD OF FORMING THE SAME

SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE

THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES

ANCHORING A TRACE ON A SUBSTRATE TO REDUCE PEELING OF THE TRACE

PACKAGE HAVING THERMAL COMPRESSION FLIP CHIP (TCFC) AND CHIP WITH R...

SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE