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Mao-Feng TSENG
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Tempe, AZ, US
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last 30 patents
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Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
Publication number
20240079259
Publication date
Mar 7, 2024
Intel Corporation
Jacob VEHONSKY
B32 - LAYERED PRODUCTS
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Patent Application
IC PACKAGE WITH MICRO LEDS
Publication number
20240079530
Publication date
Mar 7, 2024
Intel Corporation
Jacob VEHONSKY
H01 - BASIC ELECTRIC ELEMENTS