Mao GUO

Person

Shanghai, 31, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with glass spacer
- Patent number 11,393,788
- Issue date Jul 19, 2022
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages and methods for maximizing electrical cu...
- Patent number 11,373,974
- Issue date Jun 28, 2022
- Intel Corporation
- Bilal Khalaf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded active IC of passive components to miniaturize system in...
- Patent number 10,872,832
- Issue date Dec 22, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive wire through-mold connection apparatus and method
- Patent number 10,756,072
- Issue date Aug 25, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates, assembles, and techniques to enable multi-chip flip chi...
- Patent number 10,748,873
- Issue date Aug 18, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball pad with a plurality of lobes
- Patent number 10,192,840
- Issue date Jan 29, 2019
- Intel Corporation
- Yuhong Cai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
- Publication number 20220254757
- Publication date Aug 11, 2022
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF
- Publication number 20220077018
- Publication date Mar 10, 2022
- Huawei Technologies Co.,Ltd.
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
- Publication number 20210280558
- Publication date Sep 9, 2021
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES AND METHODS FOR MAXIMIZING ELECTRICAL CU...
- Publication number 20210074668
- Publication date Mar 11, 2021
- Intel Corporation
- Bilal Khalaf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE HAVING SUBSTRATE INTERPOSER AND WIREBONDS
- Publication number 20200066701
- Publication date Feb 27, 2020
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACKS
- Publication number 20190371766
- Publication date Dec 5, 2019
- Intel Corporation
- Bin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WINDOWED SUBSTRATE INTEGRATED CIRCUIT PACKAGES
- Publication number 20190355700
- Publication date Nov 21, 2019
- Intel Corporation
- Aiping Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH STRESS RELIEVING FEATURES
- Publication number 20190230788
- Publication date Jul 25, 2019
- Intel Corporation
- Mao GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUPPORTED STACKED DIE
- Publication number 20190035705
- Publication date Jan 31, 2019
- Intel Corporation
- Guo MAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD
- Publication number 20180374832
- Publication date Dec 27, 2018
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN...
- Publication number 20180331004
- Publication date Nov 15, 2018
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELIMINATING DIE SHADOW EFFECTS BY DUMMY DIE BEAMS FOR SOLDER JOINT...
- Publication number 20180323172
- Publication date Nov 8, 2018
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...
- Publication number 20180204821
- Publication date Jul 19, 2018
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL PAD WITH A PLURALITY OF LOBES
- Publication number 20170092608
- Publication date Mar 30, 2017
- Yuhong Joann Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wearable Personal Computer and Healthcare Devices
- Publication number 20160324487
- Publication date Nov 10, 2016
- Intel Corporation
- Mao GUO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Person

Patents Grantslast 30 patents

Integrated circuit package with glass spacer

Electronic device packages and methods for maximizing electrical cu...

Pre-molded active IC of passive components to miniaturize system in...

Semiconductor package with supported stacked die

Conductive wire through-mold connection apparatus and method

Substrates, assembles, and techniques to enable multi-chip flip chi...

Ball pad with a plurality of lobes

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER

CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER

ELECTRONIC DEVICE PACKAGES AND METHODS FOR MAXIMIZING ELECTRICAL CU...

STACKED CHIP PACKAGE HAVING SUBSTRATE INTERPOSER AND WIREBONDS

INTEGRATED CIRCUIT DIE STACKS

TECHNIQUES FOR WINDOWED SUBSTRATE INTEGRATED CIRCUIT PACKAGES

SUBSTRATE WITH STRESS RELIEVING FEATURES

SEMICONDUCTOR PACKAGE WITH SUPPORTED STACKED DIE

CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD

PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN...

ELIMINATING DIE SHADOW EFFECTS BY DUMMY DIE BEAMS FOR SOLDER JOINT...

SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...

BALL PAD WITH A PLURALITY OF LOBES

Wearable Personal Computer and Healthcare Devices