Mao-Hua Yeh

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package
- Patent number 12,009,340
- Issue date Jun 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test equipment and test device thereof
- Patent number 11,747,382
- Issue date Sep 5, 2023
- Siliconware Precision Industries Co., Ltd.
- Bo-Siang Fang
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,152,331
- Issue date Oct 19, 2021
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 11,081,415
- Issue date Aug 3, 2021
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,833,394
- Issue date Nov 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 10,679,914
- Issue date Jun 9, 2020
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,899,308
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor substrate of the electronic packa...
- Patent number 9,831,191
- Issue date Nov 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,666,536
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,607,939
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 9,502,335
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20220005786
- Publication date Jan 6, 2022
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST EQUIPMENT AND TEST DEVICE THEREOF
- Publication number 20210123962
- Publication date Apr 29, 2021
- Siliconware Precision Industries Co., Ltd.
- Bo-Siang Fang
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200388591
- Publication date Dec 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200258802
- Publication date Aug 13, 2020
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200235462
- Publication date Jul 23, 2020
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180254232
- Publication date Sep 6, 2018
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...
- Publication number 20170243834
- Publication date Aug 24, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20170236783
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170229387
- Publication date Aug 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160190099
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150325556
- Publication date Nov 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150069628
- Publication date Mar 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS

Mao-Hua Yeh

Person

Patents Grantslast 30 patents

Method for fabricating electronic package

Test equipment and test device thereof

Electronic package and method for fabricating the same

Method for manufacturing electronic package

Electronic package and method for fabricating the same

Electronic package and method for manufacturing the same

Semiconductor package and method of fabricating the same

Electronic package, semiconductor substrate of the electronic packa...

Package structure and fabrication method thereof

Semiconductor package and method of fabricating the same

Package structure and method for fabricating the same

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

TEST EQUIPMENT AND TEST DEVICE THEREOF

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME