Mao-Hua Yeh

Follow

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked package module and board having exposed ends
- Patent number 7,968,991
- Issue date Jun 28, 2011
- Unimicron Technology Corp.
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having heat-dissipating structure
- Patent number 7,656,015
- Issue date Feb 2, 2010
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging substrate having heat-dissipating structure
- Publication number 20090072384
- Publication date Mar 19, 2009
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package module
- Publication number 20080246135
- Publication date Oct 9, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked package module
- Publication number 20080230886
- Publication date Sep 25, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Lin-Yin Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR