Mao Ting CHANG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a semiconductor wafer and a surfa...
- Patent number 11,848,300
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 11,646,255
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a first surface mount component a...
- Patent number 11,424,213
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,322,421
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device authentication method
- Patent number 11,245,688
- Issue date Feb 8, 2022
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Data retention method
- Patent number 11,036,893
- Issue date Jun 15, 2021
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,004,827
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data exchange guide device and an execution method thereof
- Patent number 10,693,960
- Issue date Jun 23, 2020
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data retention device
- Patent number 10,515,236
- Issue date Dec 24, 2019
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 10,461,023
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device pairing method
- Patent number 10,152,587
- Issue date Dec 11, 2018
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of executing a guidance device
- Patent number 9,959,041
- Issue date May 1, 2018
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Safety navigation device and an executing method thereof
- Patent number 9,552,078
- Issue date Jan 24, 2017
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of file sharing
- Patent number 9,332,059
- Issue date May 3, 2016
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Network storage device
- Patent number D737820
- Issue date Sep 1, 2015
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Composite data transmission interface and a judgment method thereof
- Patent number 8,959,273
- Issue date Feb 17, 2015
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite card-type structure having an integrated circuit module a...
- Patent number 8,902,577
- Issue date Dec 2, 2014
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application program execution method
- Patent number 8,831,274
- Issue date Sep 9, 2014
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Foldable USB connector
- Patent number 8,770,997
- Issue date Jul 8, 2014
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascade data storage device
- Patent number 8,675,366
- Issue date Mar 18, 2014
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Data sharing system with a digital key
- Patent number 8,522,329
- Issue date Aug 27, 2013
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Screen storage device
- Patent number 8,514,559
- Issue date Aug 20, 2013
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
USB device structure
- Patent number 8,498,105
- Issue date Jul 30, 2013
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin data storage device
- Patent number 8,488,310
- Issue date Jul 16, 2013
- WALTON ADVANCED ENGINEERING INC.
- Hong-Chi Yu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE
- Publication number 20250087652
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metaverse Implementation Method
- Publication number 20240372902
- Publication date Nov 7, 2024
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371813
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR HIGH-SECURITY NETWORK MESSAGE TRANSMISSION
- Publication number 20240323153
- Publication date Sep 26, 2024
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONSTRUCTION OF A HIGH-SECURITY PRIVATE GROUP NETWORK
- Publication number 20240195784
- Publication date Jun 13, 2024
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063075
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pavithra Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark Design for Wafer-Level Testing and Method Forming th...
- Publication number 20240019486
- Publication date Jan 18, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Cheng-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF
- Publication number 20230387039
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335523
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20230253300
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20230223382
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trimming and Sawing Processes in the Formation of Wafer-Form Packages
- Publication number 20230178536
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415737
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336404
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20220302003
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220077102
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220013422
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20210305212
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE WITH A MESSAGE PROJECTION FUNCTION
- Publication number 20210157138
- Publication date May 27, 2021
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR CONNECTIONS OF PEER DEVICES
- Publication number 20210036996
- Publication date Feb 4, 2021
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TRANSACTION AUTHENTICATION METHOD
- Publication number 20200265434
- Publication date Aug 20, 2020
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE AUTHENTICATION METHOD
- Publication number 20200267140
- Publication date Aug 20, 2020
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD TO CHANGE THE CAPACITY OF A STORAGE DEVICE
- Publication number 20200264793
- Publication date Aug 20, 2020
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi YU
- G06 - COMPUTING CALCULATING COUNTING

Mao Ting CHANG

Person

Patents Grantslast 30 patents

Method of fabricating semiconductor structure including a barrier s...

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor package and manufacturing method thereof

Chip package structure including a silicon substrate interposer and...

Semiconductor structure and method of forming the same

Semiconductor structure including a semiconductor wafer and a surfa...

Semiconductor package and manufacturing method of semiconductor pac...

Chip package structure including a silicon substrate interposer and...

Semiconductor structure including a first surface mount component a...

Package structure and method of forming the same

Device authentication method

Data retention method

Semiconductor package and manufacturing method of semiconductor pac...

Data exchange guide device and an execution method thereof

Data retention device

Semiconductor packages and methods of forming the same

Device pairing method

Method of executing a guidance device

Safety navigation device and an executing method thereof

Method of file sharing

Network storage device

Composite data transmission interface and a judgment method thereof

Composite card-type structure having an integrated circuit module a...

Application program execution method

Foldable USB connector

Cascade data storage device

Data sharing system with a digital key

Screen storage device

USB device structure

Thin data storage device

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

Metaverse Implementation Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR HIGH-SECURITY NETWORK MESSAGE TRANSMISSION

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR STRUCTURE

METHOD FOR CONSTRUCTION OF A HIGH-SECURITY PRIVATE GROUP NETWORK

Integrated Circuit Package and Method

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

Alignment Mark Design for Wafer-Level Testing and Method Forming th...

SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

Trimming and Sawing Processes in the Formation of Wafer-Form Packages

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

STORAGE DEVICE WITH A MESSAGE PROJECTION FUNCTION

METHOD FOR CONNECTIONS OF PEER DEVICES

TRANSACTION AUTHENTICATION METHOD

DEVICE AUTHENTICATION METHOD

METHOD TO CHANGE THE CAPACITY OF A STORAGE DEVICE