Marc Alan Mangrum

Person

Manchaca, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 12,062,833
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 11,677,135
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
- Patent number 11,658,099
- Issue date May 23, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 10,923,800
- Issue date Feb 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip self-alignment features for substrate and leadframe appli...
- Patent number 10,861,776
- Issue date Dec 8, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded vibration management system having an array of vibration a...
- Patent number 10,861,798
- Issue date Dec 8, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 10,566,680
- Issue date Feb 18, 2020
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having inspection structure and related methods
- Patent number 10,490,487
- Issue date Nov 26, 2019
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having inspection structure and related methods
- Patent number 10,211,128
- Issue date Feb 19, 2019
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded vibration management system
- Patent number 10,032,726
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip self-alignment features for substrate and leadframe appli...
- Patent number 10,032,699
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 9,966,652
- Issue date May 8, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with conductive interconn...
- Patent number 9,917,039
- Issue date Mar 13, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with clip alignment notch
- Patent number 9,870,985
- Issue date Jan 16, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding technique for semiconductor package including metal lid
- Patent number 9,362,209
- Issue date Jun 7, 2016
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding technique for semiconductor package including metal lid a...
- Patent number 9,153,543
- Issue date Oct 6, 2015
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with integrated electrostatic discharge protection
- Patent number 8,633,575
- Issue date Jan 21, 2014
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package including two devices
- Patent number 8,415,203
- Issue date Apr 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kenneth R. Burch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making an integrated circuit package with shielding via r...
- Patent number 8,097,494
- Issue date Jan 17, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device with at least partial packaging and method for forming
- Patent number 8,072,062
- Issue date Dec 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package level ESD protection and method therefor
- Patent number 8,059,380
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Sergio A. Ajuria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable molded packages and methods of making the same
- Patent number 8,044,494
- Issue date Oct 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device package with impro...
- Patent number 7,892,882
- Issue date Feb 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a device having a multi-contact elastomer conne...
- Patent number 7,807,511
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test interposer having active circuit component and method therefor
- Patent number 7,808,258
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Marc A Mangrum
- G01 - MEASURING TESTING
Information Patent Grant
Method of packaging a device having a tangible element and device t...
- Patent number 7,696,016
- Issue date Apr 13, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device and a prefabricated conn...
- Patent number 7,655,502
- Issue date Feb 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shield formation for integrated circuit die package
- Patent number 7,651,889
- Issue date Jan 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device and a prefabricated conn...
- Patent number 7,588,951
- Issue date Sep 15, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a device using a dielectric layer
- Patent number 7,476,563
- Issue date Jan 13, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20230335883
- Publication date Oct 19, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan MANGRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20210265247
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20210151854
- Publication date May 20, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan MANGRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20200153082
- Publication date May 14, 2020
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS
- Publication number 20190122964
- Publication date Apr 25, 2019
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20190043789
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED VIBRATION MANAGEMENT SYSTEM
- Publication number 20180374800
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS
- Publication number 20180350726
- Publication date Dec 6, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20180191055
- Publication date Jul 5, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH
- Publication number 20180012829
- Publication date Jan 11, 2018
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONN...
- Publication number 20170309554
- Publication date Oct 26, 2017
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...
- Publication number 20170125881
- Publication date May 4, 2017
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20110003435
- Publication date Jan 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING HAVING TWO DEVICES AND METHOD OF FORMING THEREOF
- Publication number 20100078808
- Publication date Apr 1, 2010
- KENNETH R. BURCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20100013065
- Publication date Jan 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST INTERPOSER HAVING ACTIVE CIRCUIT COMPONENT AND METHOD THEREFOR
- Publication number 20090322364
- Publication date Dec 31, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONN...
- Publication number 20090286390
- Publication date Nov 19, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LEVEL ESD PROTECTION AND METHOD THEREFOR
- Publication number 20090284881
- Publication date Nov 19, 2009
- Sergio A. Ajuria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20090075428
- Publication date Mar 19, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE WITH AT LEAST PARTIAL PACKAGING AND METHOD FOR FORMING
- Publication number 20080142960
- Publication date Jun 19, 2008
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT
- Publication number 20080119004
- Publication date May 22, 2008
- Kenneth R. Burch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A DEVICE HAVING A TANGIBLE ELEMENT AND DEVICE T...
- Publication number 20080116560
- Publication date May 22, 2008
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A DEVICE HAVING A MULTI-CONTACT ELASTOMER CONNE...
- Publication number 20080116573
- Publication date May 22, 2008
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONN...
- Publication number 20080119015
- Publication date May 22, 2008
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A DEVICE USING A DIELECTRIC LAYER
- Publication number 20080119013
- Publication date May 22, 2008
- Marc A. Mangrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20080108179
- Publication date May 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for a semiconductor device package with impro...
- Publication number 20070284704
- Publication date Dec 13, 2007
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable molded packages and methods of making the same
- Publication number 20070141751
- Publication date Jun 21, 2007
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for stacking an integrated circuit on another integrated...
- Publication number 20060231938
- Publication date Oct 19, 2006
- Marc A. Mangrum
- H01 - BASIC ELECTRIC ELEMENTS

Marc Alan Mangrum

Person

Patents Grantslast 30 patents

Packaged electronic device having integrated antenna and locking st...

Packaged electronic device having integrated antenna and locking st...

Flip chip curved sidewall self-alignment features for substrate and...

Packaged electronic device having integrated antenna and locking st...

Flip chip self-alignment features for substrate and leadframe appli...

Embedded vibration management system having an array of vibration a...

Packaged electronic device having integrated antenna and locking st...

Semiconductor package having inspection structure and related methods

Semiconductor package having inspection structure and related methods

Embedded vibration management system

Flip chip self-alignment features for substrate and leadframe appli...

Packaged electronic device having integrated antenna and locking st...

Method of forming a semiconductor package with conductive interconn...

Semiconductor package with clip alignment notch

Shielding technique for semiconductor package including metal lid

Shielding technique for semiconductor package including metal lid a...

IC package with integrated electrostatic discharge protection

Method of forming a semiconductor package including two devices

Method of making an integrated circuit package with shielding via r...

Circuit device with at least partial packaging and method for forming

Package level ESD protection and method therefor

Stackable molded packages and methods of making the same

Methods and apparatus for a semiconductor device package with impro...

Method of packaging a device having a multi-contact elastomer conne...

Test interposer having active circuit component and method therefor

Method of packaging a device having a tangible element and device t...

Method of packaging a semiconductor device and a prefabricated conn...

Electromagnetic shield formation for integrated circuit die package

Method of packaging a semiconductor device and a prefabricated conn...

Method of packaging a device using a dielectric layer

Patents Applicationslast 30 patents

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

EMBEDDED VIBRATION MANAGEMENT SYSTEM

SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH

METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONN...

PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING ST...

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

PACKAGING HAVING TWO DEVICES AND METHOD OF FORMING THEREOF

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

TEST INTERPOSER HAVING ACTIVE CIRCUIT COMPONENT AND METHOD THEREFOR

METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONN...

PACKAGE LEVEL ESD PROTECTION AND METHOD THEREFOR

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

CIRCUIT DEVICE WITH AT LEAST PARTIAL PACKAGING AND METHOD FOR FORMING

METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT

METHOD OF PACKAGING A DEVICE HAVING A TANGIBLE ELEMENT AND DEVICE T...

METHOD OF PACKAGING A DEVICE HAVING A MULTI-CONTACT ELASTOMER CONNE...

METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONN...

METHOD OF PACKAGING A DEVICE USING A DIELECTRIC LAYER

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Methods and apparatus for a semiconductor device package with impro...

Stackable molded packages and methods of making the same

Structure for stacking an integrated circuit on another integrated...