Marc Feron

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Patents Grantslast 30 patents

Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,785,297
- Issue date Jul 22, 2014
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning and dicing electronic circuit wafers
- Patent number 8,486,763
- Issue date Jul 16, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,309,403
- Issue date Nov 13, 2012
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20130043586
- Publication date Feb 21, 2013
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THINNING AND DICING ELECTRONIC CIRCUIT WAFERS
- Publication number 20120149174
- Publication date Jun 14, 2012
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20110124157
- Publication date May 26, 2011
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS