Marc Huan

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Cox, FR

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly having high interconnection density
- Patent number 6,754,405
- Issue date Jun 22, 2004
- Alcatel
- Olivier Vendier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modifying connecting leads and thinning bases of encapsul...
- Patent number 6,683,373
- Issue date Jan 27, 2004
- Alcatel
- Olivier Vendier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic assembly having high interconnection density
- Publication number 20010050430
- Publication date Dec 13, 2001
- ALCATEL
- Olivier Vendier
- G02 - OPTICS