Marc Huesgen

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and production method
- Patent number 9,253,886
- Issue date Feb 2, 2016
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING METAL LAYER CONFIGURED FOR ELECTROMAGNETIC INTER...
- Publication number 20220285286
- Publication date Sep 8, 2022
- QUALCOMM TECHNOLOGIES INC.
- Marc HUESGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND PRODUCTION METHOD
- Publication number 20130176686
- Publication date Jul 11, 2013
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY