MARC ZUSSY

Person

SAINTE EGREVE, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Temporary bonding method with thermoplastic adhesive incorporating...
- Patent number 11,088,010
- Issue date Aug 10, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer trimming
- Patent number 10,818,500
- Issue date Oct 27, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Franck Fournel
- B24 - GRINDING POLISHING
Information Patent Grant
Method for recycling a substrate holder
- Patent number 10,100,400
- Issue date Oct 16, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning samples
- Patent number 9,842,742
- Issue date Dec 12, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jérôme Dechamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for assembling two wafers and corresponding device
- Patent number 9,330,957
- Issue date May 3, 2016
- STMicroelectronics (Crolles 2) SAS
- Aomar Halimaoui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate holder
- Patent number 9,321,636
- Issue date Apr 26, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating polymer film in the cavity of a wafer
- Patent number 9,219,004
- Issue date Dec 22, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building a substrate holder
- Patent number 8,828,244
- Issue date Sep 9, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for trimming a structure obtained by the assembly of two plates
- Patent number 8,628,674
- Issue date Jan 14, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Marc Zussy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for trimming a structure obtained by the assembly of two plates
- Patent number 8,329,048
- Issue date Dec 11, 2012
- Commissariat a l'Energie Atomique
- Marc Zussy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and device for separating a structure
- Patent number 8,302,278
- Issue date Nov 6, 2012
- Commissariat a l'Energie Atomique
- Marc Zussy
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of fabricating a mixed microtechnology structure and a struc...
- Patent number 7,947,564
- Issue date May 24, 2011
- Commissariat a l'Energie Atomique
- Marek Kostrzewa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microbattery comprising through-connections and production method t...
- Patent number 7,811,702
- Issue date Oct 12, 2010
- Commissariat a l'Energie Atomique
- Jean-Yves Laurent
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Detachable substrate or detachable structure and method for the pro...
- Patent number 7,713,369
- Issue date May 11, 2010
- Commissariat a l'Energie Atomique
- Bernard Aspar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing mixed stacked structures, with various insulat...
- Patent number 7,541,263
- Issue date Jun 2, 2009
- Commissariat a l'Energie Atomique
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing mixed substrates and structure thus obtained
- Patent number 7,494,897
- Issue date Feb 24, 2009
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a stacked structure
- Patent number 7,229,897
- Issue date Jun 12, 2007
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling semiconductor layers in such a way as to thin same
- Patent number 7,205,211
- Issue date Apr 17, 2007
- Commisariat l'Energie Atomique
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for the manufacture of passive and active components on the...
- Patent number 6,197,695
- Issue date Mar 6, 2001
- Commissariat a l'Energie Atomique
- Jean-Pierre Joly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring a thin film from an initial substrate onto...
- Patent number 5,993,677
- Issue date Nov 30, 1999
- Commissariat a l'Energie Atomique
- Beatrice Biasse
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY BONDING METHOD WITH THERMOPLASTIC ADHESIVE INCORPORATING...
- Publication number 20200090977
- Publication date Mar 19, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER TRIMMING
- Publication number 20190206693
- Publication date Jul 4, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for thinning samples
- Publication number 20170117158
- Publication date Apr 27, 2017
- COMMISSARIA À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Jérôme DECHAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE
- Publication number 20160218178
- Publication date Jul 28, 2016
- STMicroelectronics (Crolles 2) SAS
- AOMAR HALIMAOUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING A MECHANICAL OPERATION IN A STRUCTURE COMPRIS...
- Publication number 20140238213
- Publication date Aug 28, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Hubert Moriceau
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD FOR RECYCLING A SUBSTRATE HOLDER
- Publication number 20140178596
- Publication date Jun 26, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE HOLDER
- Publication number 20140014618
- Publication date Jan 16, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Frank Fournel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR PRODUCING A FILM, FOR EXAMPLE A SINGLE-CRYSTAL FILM, ON...
- Publication number 20130196484
- Publication date Aug 1, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING A SUBSTRATE HOLDER
- Publication number 20130075365
- Publication date Mar 28, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES
- Publication number 20130078785
- Publication date Mar 28, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Marc Zussy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE
- Publication number 20120161292
- Publication date Jun 28, 2012
- Aomar Halimaoui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SEPARATING A STRUCTURE
- Publication number 20090165277
- Publication date Jul 2, 2009
- Marc Zussy
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES
- Publication number 20090095399
- Publication date Apr 16, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Marc Zussy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Assembling Substrates By Depositing An Oxide Or Nitride...
- Publication number 20080311725
- Publication date Dec 18, 2008
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A MIXED MICROTECHNOLOGY STRUCTUE AND A STRUCT...
- Publication number 20080079123
- Publication date Apr 3, 2008
- Marek Kostrzewa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method Of Transferring At Least One Object Of Micrometric Or Millim...
- Publication number 20080020547
- Publication date Jan 24, 2008
- Marek Kostrzewa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Providing Mixed Stacked Structures, with Various Insulat...
- Publication number 20070259528
- Publication date Nov 8, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microbattery Comprising Through-Connections and Production Method T...
- Publication number 20070238019
- Publication date Oct 11, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jean-Yves Laurent
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of producing mixed substrates and structure thus obtained
- Publication number 20060166461
- Publication date Jul 27, 2006
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for re-routing lithography-free microelectronic devices
- Publication number 20060128134
- Publication date Jun 15, 2006
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Baleras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for handling semiconductor layers in such a way as to thin same
- Publication number 20050124138
- Publication date Jun 9, 2005
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a stacked structure
- Publication number 20050101095
- Publication date May 12, 2005
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Detachable substrate or detachable structure and method for the pro...
- Publication number 20050029224
- Publication date Feb 10, 2005
- Bernard Aspar
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Temporary bonding method with thermoplastic adhesive incorporating...

Method for wafer trimming

Method for recycling a substrate holder

Method for thinning samples

Process for assembling two wafers and corresponding device

Method for producing a substrate holder

Method of fabricating polymer film in the cavity of a wafer

Method for building a substrate holder

Method for trimming a structure obtained by the assembly of two plates

Method for trimming a structure obtained by the assembly of two plates

Method and device for separating a structure

Method of fabricating a mixed microtechnology structure and a struc...

Microbattery comprising through-connections and production method t...

Detachable substrate or detachable structure and method for the pro...

Method for providing mixed stacked structures, with various insulat...

Method of producing mixed substrates and structure thus obtained

Method for producing a stacked structure

Method for handling semiconductor layers in such a way as to thin same

Process for the manufacture of passive and active components on the...

Process for transferring a thin film from an initial substrate onto...

Patents Applicationslast 30 patents

TEMPORARY BONDING METHOD WITH THERMOPLASTIC ADHESIVE INCORPORATING...

METHOD FOR WAFER TRIMMING

Method for thinning samples

PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE

METHOD FOR PERFORMING A MECHANICAL OPERATION IN A STRUCTURE COMPRIS...

METHOD FOR RECYCLING A SUBSTRATE HOLDER

METHOD FOR PRODUCING A SUBSTRATE HOLDER

PROCESS FOR PRODUCING A FILM, FOR EXAMPLE A SINGLE-CRYSTAL FILM, ON...

METHOD FOR BUILDING A SUBSTRATE HOLDER

METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES

PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE

METHOD AND DEVICE FOR SEPARATING A STRUCTURE

METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES

Method For Assembling Substrates By Depositing An Oxide Or Nitride...

METHOD OF FABRICATING A MIXED MICROTECHNOLOGY STRUCTUE AND A STRUCT...

Method Of Transferring At Least One Object Of Micrometric Or Millim...

Method for Providing Mixed Stacked Structures, with Various Insulat...

Microbattery Comprising Through-Connections and Production Method T...

Method of producing mixed substrates and structure thus obtained

Method for re-routing lithography-free microelectronic devices

Method for handling semiconductor layers in such a way as to thin same

Method for producing a stacked structure

Detachable substrate or detachable structure and method for the pro...