Marcel Said

Person

Beaverton, OR, US

People

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...
- Publication number 20250216636
- Publication date Jul 3, 2025
- Intel Corporation
- Vinod ADIVARAHAN
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES
- Publication number 20250219032
- Publication date Jul 3, 2025
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
- Publication number 20250218915
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
- Publication number 20250218961
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...
- Publication number 20250201787
- Publication date Jun 19, 2025
- Intel Corporation
- Marcel M. Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRC...
- Publication number 20240345324
- Publication date Oct 17, 2024
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS

Marcel Said

Person

Patents Applicationslast 30 patents

OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

Technologies for Components Embedded in a Substrate Core

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...

SPACER FOR EMBEDDED COMPONENT IN CORE

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...

OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRC...