Marco Aurelio Cartas

Follow

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with solder thermal interface materials...
- Patent number 12,272,614
- Issue date Apr 8, 2025
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channeled lids for integrated circuit packages
- Patent number 11,670,569
- Issue date Jun 6, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHANNELED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200395269
- Publication date Dec 17, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...
- Publication number 20200381332
- Publication date Dec 3, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...
- Publication number 20200373220
- Publication date Nov 26, 2020
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN LINE DAM ON UNDERFILL MATERIAL TO CONTAIN THERMAL INTERFACE MA...
- Publication number 20200126887
- Publication date Apr 23, 2020
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS