Marco Bäßler

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Oeversee, DE

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20250062290
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240404925
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...
- Publication number 20240332136
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240047289
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bässler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES
- Publication number 20230361088
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS