Marco Haubold

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for wafer bonding and compound semiconductor wafer
- Patent number 12,068,296
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a moisture sensor at the wafer level and moist...
- Patent number 11,428,661
- Issue date Aug 30, 2022
- Infineon Technologies AG
- Marco Haubold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed decoupled micro-electro-mechanical system sensor
- Patent number 10,870,575
- Issue date Dec 22, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device and manufacturing method
- Patent number 10,386,255
- Issue date Aug 20, 2019
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device, pressure sensor, microphone, and acceleration...
- Patent number 10,329,140
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Marco Haubold
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE AND METHOD FOR OPERATING A MEMS DEVICE
- Publication number 20240425361
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Björn Oliver Eversmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Apparatus Having Such a MEMS Device
- Publication number 20230406694
- Publication date Dec 21, 2023
- INFINEON TECHNOLOGIES AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Audio Device Including Such a MEMS Device
- Publication number 20230412968
- Publication date Dec 21, 2023
- INFINEON TECHNOLOGIES AG
- Christian Bretthauer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER
- Publication number 20220238501
- Publication date Jul 28, 2022
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Moisture Sensor at the Wafer Level and Moist...
- Publication number 20200166471
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Marco Haubold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
- Publication number 20200002159
- Publication date Jan 2, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, PRESSURE SENSOR, MICROPHONE, ACCELERATION SEN...
- Publication number 20180222744
- Publication date Aug 9, 2018
- INFINEON TECHNOLOGIES AG
- Marco Haubold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD
- Publication number 20180017456
- Publication date Jan 18, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Application
Damping of a Sensor
- Publication number 20180003503
- Publication date Jan 4, 2018
- INFINEON TECHNOLOGIES AG
- Marco Haubold
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Marco Haubold

Person

Patents Grantslast 30 patents

Method for wafer bonding and compound semiconductor wafer

Method for producing a moisture sensor at the wafer level and moist...

Stressed decoupled micro-electro-mechanical system sensor

Pressure sensor device and manufacturing method

Semiconductor device, pressure sensor, microphone, and acceleration...

Patents Applicationslast 30 patents

MEMS DEVICE AND METHOD FOR OPERATING A MEMS DEVICE

MEMS Device and Apparatus Having Such a MEMS Device

MEMS Device and Audio Device Including Such a MEMS Device

METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER

Method for Producing a Moisture Sensor at the Wafer Level and Moist...

STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

SEMICONDUCTOR DEVICE, PRESSURE SENSOR, MICROPHONE, ACCELERATION SEN...

PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD

Damping of a Sensor